ASE Group

ASE Group’s broad portfolio of technology and solutions encompass IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, MEMS, final test and electronic manufacturing services. Leading the OSAT market, ASE generated sales revenues of over $4.4 Billion in 2012 and employs over 42,000 people worldwide. For more on our proven copper wire bond capabilities and our advances in 3D & TSV technologies, please visit www.aseglobal.com.