Wafer from glass or quartz (silica) up to 300 mm

Wafer from glass or quartz (silica) up to 300 mm

Polished wafer for wafer level packaging of MEMS or optoelectronics

Specifications:

  • Double side polished
  • low TTV
  • Small thickness (down to 150 micron) possible
  • TTV adapted to device wafer material (e.g. Si)

Categories: Advanced Materials > Glass Wafers | Quartz Wafers |
Manufacturer: Plan Optik
Model: