Wafer from glass or quartz (silica) up to 300 mm
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Wafer from glass or quartz (silica) up to 300 mm

Polished wafer for wafer level packaging of MEMS or optoelectronics

Specifications:

  • Double side polished
  • low TTV
  • Small thickness (down to 150 micron) possible
  • TTV adapted to device wafer material (e.g. Si)

Categories: Advanced Materials > Glass Wafers | Quartz Wafers |
Manufacturer: Plan Optik
Model: