Functional Capping™ (Wafer Level Bonding)

Functional Capping™ (Wafer Level Bonding)

This process includes a number of different wafer bonding techniques which creates a sealed cap fixed to the active deivce. These are typically hermetic and can include active MEMS or CMOS as base wafers. Adding a Through Silicon Via in the cap wafer supports true flip chip functionality.

Please contact Silex for complete specifications.

Categories: Foundry Services > Wafer Bonding |
Manufacturer: Silex Microsystems
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