SmartView® Wafer-to-Wafer Bond Aligner for face-to-face alignment up to 300mm

SmartView® Wafer-to-Wafer Bond Aligner for face-to-face alignment up to 300mm

SmartView® Wafer-to-Wafer Bond Aligner for face-to-face alignment up to 300mm
Innovative solution for face-to-face alignment with EVG’s proprietary SmartView® technology based on a high-precision alignment stage with top and bottom side microscopes

Categories: Equipment > Mask and Bonder Aligners |
Manufacturer: EV Group
Model: SmartView®