EVG®540 Fully-Automated Wafer Bonding System up to 300mm

EVG®540 Fully-Automated Wafer Bonding System up to 300mm

EVG®540 Fully-Automated Wafer Bonding System up to 300mm
Fully-automated processing with manual loading and unloading, anodic, thermo compression, fusion bonding, or LowTemp Plasma Bonding

Categories: Equipment > Wafer Bonding |
Manufacturer: EV Group
Model: EVG®540