EVG®810LT LowTemp® Plasma Activation System

EVG®810LT LowTemp® Plasma Activation System

EVG®810LT LowTemp® Plasma Activation System
EVG’s LowTemp Plasma Bonding technology offers the highest bond strength at the lowest possible temperatures

Categories: Equipment > Wafer Bonding |
Manufacturer: EV Group
Model: EVG®810LT LowTemp