EVG®850 Series SOI/Fusion Bonding System

EVG®850 Series SOI/Fusion Bonding System

EVG®850 Series SOI/Fusion Bonding System
The SOI bonding systems from EVG are known as industry-wide leading production systems that achieve highest yield and void-free bonded SOI wafers

Categories: Equipment > Wafer Bonding |
Manufacturer: EV Group
Model: EVG®850