Okmetic BSOI or thick Bonded SOI (Silicon On Insulator) wafers
Okmetic BSOI or thick Bonded SOI (Silicon On Insulator) wafers improve cost-efficiency across processes, boost performance, and make possible completely new device designs. Together with modern manufacturing processes (e.g. DRIE) they provide new opportunities for innovation and exceptional design. For the most demanding designs, Okmetic 0.3-SOI wafers with tighter device layer thickness tolerance offers even more benefits in terms of device performance.
Okmetic SOI product family includes enhanced SOI products that meet the most demanding customer requirements. They enable the development of smaller devices, while allowing for greater freedom of design and improved yield.
Diameters from 100 mm up to 200 mm