EVG®850 Fully-Automated Temporary Bonder/Debonder (ultra-thin wafer processing)

EVG®850 Fully-Automated Temporary Bonder/Debonder (ultra-thin wafer processing)

Temporary bonding and debonding technology for reliable, breakage-free handling of fragile c compound semiconductor wafers or other ultra-thin substrates

Categories: Equipment > Wafer Bonding |
Manufacturer: EV Group
Model: EVG®850