Prototyping and Low Volume Services

Prototyping and Low Volume Services

Industry segment served (volume): Prototype and low-volume

Wafer size and supported materials: 100mm or 150 mm wafers, silicon, glass, SOI, quartz, all MEMS materials and processes

Processes employed: All MEMS processes:

  • Stepper and contact lithography
  • Thin and thick film deposition
  • Etching
  • Deep etching
  • Wet etching
  • Anodic bonding
  • Metrology
  • Dicing
  • Polymer films
  • Sacrificial release

Categories: Foundry Services > Design | Design for Manufacturability (DFM) | Feasability | Low Volume Fabrication | Mask Layout | Modeling | Packaging | Pilot Services | Process Development | Prototyping | Research & Development | Runsheet Development | Silicon Deep Reactive Ion Etch (RIE) | Solar Cell Fabrication | Technology Transfer to Foundry | University Work |
Manufacturer: A.M. Fitzgerald & Associates, LLC
Model: