Supported wafer size & materials: 200mm wafers / Si / glass Processes employed: Broad range of processes available (litho, etching, coating, tth, wafer bonding…). Different generic process flows are available for different microcomponents (mechanical sensors, RF MEMS…) as well as for heterogeneous integration (3D wafer level packaging, 3D-IC), specially adapted to different typologies of customers (integrators, IDM,…°