Leti Foundry Services

Leti Foundry Services

Supported wafer size & materials: 200mm wafers / Si / glass Processes employed: Broad range of processes available (litho, etching, coating, tth, wafer bonding…). Different generic process flows are available for different microcomponents (mechanical sensors, RF MEMS…) as well as for heterogeneous integration (3D wafer level packaging, 3D-IC), specially adapted to different typologies of customers (integrators, IDM,…°

Categories: Foundry Services > Design | Feasability | Low Volume Fabrication | Metal Via | Modeling | Packaging | Pilot Services | Process Development | Prototyping | Research & Development | Silicon Deep Reactive Ion Etch (RIE) | Technology Transfer to Foundry | Through Silicon Via | Wafer Bonding |
MEMS Devices > Accelerometers | Functional Sensors | Gyroscopes | Optical MEMS | Pressure Sensors | Relative Humidity Sensors | RF-MEMS | Temperature Sensors |
Other > Education | Information |
Manufacturer: Leti
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