SUSS MA/BA8 Gen3 Mask and Bond Aligner
The MA/BA8 Gen3 is the new benchmark in full-field lithography for MEMS, Advanced Packaging, 3D Integration and Compound Semiconductor markets. In addition, it supports emerging processes like micro- and nano-imprinting, bond alignment and UV-bonding as well as selective Plasma activation with its unmatched variety of options and maximum flexibility.
Because of their ability to easily process virtually all kinds of wafer and substrate materials, manual aligners are increasingly used in production environments. With the new MA/BA8 Gen3 SUSS MicroTec addresses the growing demand for tighter process control coupled with high yield. The MA/BA8 Gen3 is a highly versatile system for R&D and operator-assisted production. In addition it allows easy and fast upgrades to complementary technologies.