HF Sacrificial Vapor Release Etching

HF Sacrificial Vapor Release Etching

Vapor phase dry release with HF

Using memsstar's® dry anhydrous HF etching eliminates stiction in a single process. The patented process is compatible with the widest wide range of metals – especially Al/alloy and other metals used in MEMS mirrors and electrical contacts.

Single wafer processing guarantees excellent repeatability with a wide process window to maximise performance and yield. Unique process controls and monitors deliver tuneable etch rates, uniformity and selectivity, with endpoint capability and thermal control of the wafer during etch.

Categories: Equipment > Chemical Vapour Etching (CVE) | Dry Etch Release |
Foundry Services > Process Development | Research & Development |
Manufacturer: memsstar
Model: