memsstar's Multi platform offers automated wafer handling, cluster capability and process integration for up to three memsstar® process modules for volume MEMS production.
There is a choice of advanced memsstar® etch, surface preparation and deposition process modules delivering the performance, control and yield for manufacturing current and next-generation MEMS devices. Fabs can start with just one process, for example SVR etching, and then add other etch and/or surface preparation and deposition modules to the cluster as they are required. All process modules are based on memstar’s unique technologies for advanced process control, faster process times, denser more robust films, superior within wafer uniformity and wafer to wafer repeatability. We work closely with customers to develop new applications quickly on this highly flexible platform.
Each memsstar® process module uses a small volume vacuum chamber able to process all standard sizes of substrates - 100mm, 125mm, 150mm, 200mm - or many different types of carriers and substrates. Chambers are process specific with an optimized process kit for a particular substrate or design, with excellent process control.
Each system is a compact small footprint and easily connected to cleanroom facilities. Chemicals and electronics are on board for non-toxics so ancillary equipment is minimized.