Micro-Mirror / 2d-Scanner - MEMS Industry Group

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Micro-Mirror / 2d-Scanner

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Micro-Mirror / 2d-Scanner

Categories:	Advanced Materials > Bonding Material \| Etch Mask \| Getters \| Glass Frit \| Glass Wafers \| Packaging \| Polishing Slurry \| Process Carrier \| Protection Coating \| Quartz Wafers \| Sealing Glass \| Silicon Wafers \| Structured Wafers and Substrates \| Equipment > Batch develop \| Chemical Vapor Deposition Systems \| Chemical Vapour Etching (CVE) \| Cleaning \| Coat Develop and Expose \| Coating \| Deep Reactive Ion Etching (DRIE) Systems \| Deep Silicon Etch Systems \| Dry Etch Release \| Electroetching \| Electroplating \| Lithography \| Manual Wet Bench \| Mask Aligner \| Mask and Bonder Aligners \| Metal Lift Off \| Metrology Instrumentation \| Packaging \| Physical Vapor Deposition (PVD) Systems \| Plasma Enhanced Chemical Vapour Deposition (PECVD) \| Plasma Etching Systems \| Semi Automated Wet Processing System \| Stripping \| Testing \| Wafer Bonding \| Wet etching \| Foundry Services > Design \| Feasability \| Low Volume Fabrication \| Manufacturing Services \| Mask Layout \| Metal Via \| Modeling \| Packaging \| Pilot Services \| Process Development \| Prototyping \| Research & Development \| Silicon Deep Reactive Ion Etch (RIE) \| Technology Transfer to Foundry \| Through Silicon Via \| Wafer Bonding \| MEMS Devices > Accelerometers \| Energy \| Flow Sensors \| Gyroscopes \| Optical MEMS \| RF-MEMS \| Other > Cleanroom \| Research Laboratory \| Professional Services > Consulting \| Design \| Device Services \| Inspection \| Mask Layout \| Modeling & Analysis \| Packaging \| Process Design \| Software > Simulation tools \|
Manufacturer:	Fraunhofer ISIT
Model: