The VERTICAL 200 SOLVENT is capable to handle all solvent and solvent based chemicals up to 95°C. 4 Chemical Process Chambers combine 2 steps in one Chamber: soaking and processing itself. This ensures dry Substrate handling. within the whole System. Separate Rinse/Dry Chambers are available for final cleaning. The VERTICAL 200 SOLVENT has a unique Substrate face down processing and closed Process Chamber design. This System can handle multiple Substrate Sizes without manual interruption

ADVANTAGES: Throughput >100 Wafers per hour; Substrate Face Down Processing; Soak and Lift Off in one Module; Separate Rinse/Dry Module; 1.65m x 2.5m Footprint; Encapsulated System; Dry Wafer Handling; Closed Chambers;

VERTICAL 200 SOLVENT APPLICATIONS: Metal Lift Off; Polymer Removal; Resist Strip;