At STC our experienced team and cutting edge tool set provides cutting-edge wafer level packaging and 3-D integration at the device and wafer level. The power of our co-located wafer foundry and packaging facilities provide a vertically integrated resource that addresses customers needs.

Housed in a Class 100/ Class 1000 clean space, STC’s packaging lab is designed to offer solutions that optimize critical small form factors, cost, performance and reliability.

- Adhesive Dispensive - Dicing - Electroplating - Flip Chip / Die Bonding - Hermetic Package Sealing - Plasma Processing / Cleaning - Surface Modification & Coating - Wafer-Scale Bonding - Wire Bonding