Until now, MEMS designers have typically focused purely on geometric representation of the device in order to analyze device behavior. The drawback of this methodology is that process induced effects may vary the geometry of the structure significantly. For example, the boron diffusion as an etch stop layer for bulk silicon processing may overstress the structure, strain gradients in poly-silicon structures can distort features, or an anodic bonding process may break down protective oxide films.
IntelliFAB allows designers to takes a different approach. Process flow forms the basis of creating your devices. Our comprehensive process simulation modules incorporate deposition, etching, bonding, doping, electroplating, liftoff, and other process steps common in MEMS design. Other process- induced effects, such as micro-assembly, are also addressed to generate accurate geometric models for the complete range of MEMS devices.
IntelliFab works hand-in-hand with our powerful process flow visualization tools, FabViewer and FabSim. IntelliFAB is also directly linked with MEMaterial, our MEMS process database that stores material properties as a function of your machine settings. By developing the fabrication process in conjunction with the analysis model, IntelliSuite enables engineers to perform more accurate device physics analysis and produce manufacturable devices faster.