Single & Double Side Polished Glass Wafers

Single & Double Side Polished Glass Wafers

Pyrex, Borofloat, Fused Silica. Round or square, Dimensions to 8”/200 mm, thickness down to 300 µ

Specifications: -TTV<9 µ -Ra < 15 Angstroms -Global Flatness< 40 µ

-Minimal to no "latent scratches" for superior anodic bonding and high reliability applications.

Categories: Advanced Materials > Glass Wafers | Micro Abrasive Jet Machined Wafers and Substrates | Quartz Wafers | Structured Wafers and Substrates |
Foundry Services > Process Development | Prototyping | Research & Development |
MEMS Devices > Flow Sensors | Gyroscopes | Optical MEMS | Pressure Sensors |
Manufacturer: Bullen
Model: