Micro Abrasive Jet Machined wafers/substrates in glass, fused silica and quartz

Micro Abrasive Jet Machined wafers/substrates in glass, fused silica and quartz

Specifications: -Round, square, odd shaped holes, channels & cavities

-Features are tapered at 22deg, minimum dimension of 100 microns. Aspect ratio up to 3, locational tolerance to +/- 25 µ

-Features are tapered at 22deg, minimum dimension of 100 microns. Aspect ratio up to 3, locational tolerance to +/- 25 µ.

Categories: Advanced Materials > Glass Wafers | Micro Abrasive Jet Machined Wafers and Substrates | Quartz Wafers | Structured Wafers and Substrates |
Foundry Services > Manufacturing Services | Process Development | Prototyping | Research & Development |
MEMS Devices > Flow Sensors | Gyroscopes | Pressure Sensors | Tire Pressure Monitoring System (TPMS) |
Manufacturer: Bullen
Model: