Micro Abrasive Jet Machined wafers/substrates in glass, fused silica and quartz

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Micro Abrasive Jet Machined wafers/substrates in glass, fused silica and quartz

Specifications: -Round, square, odd shaped holes, channels & cavities

-Features are tapered at 22deg, minimum dimension of 100 microns. Aspect ratio up to 3, locational tolerance to +/- 25 µ

-Features are tapered at 22deg, minimum dimension of 100 microns. Aspect ratio up to 3, locational tolerance to +/- 25 µ.

Categories:	Advanced Materials > Glass Wafers \| Micro Abrasive Jet Machined Wafers and Substrates \| Quartz Wafers \| Structured Wafers and Substrates \| Foundry Services > Manufacturing Services \| Process Development \| Prototyping \| Research & Development \| MEMS Devices > Flow Sensors \| Gyroscopes \| Pressure Sensors \| Tire Pressure Monitoring System (TPMS) \|
Manufacturer:	Bullen
Model:

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