SUSS MA200 Compact Production Aligner
With the MA200Compact SUSS MicroTec has designed a state-of the art mask aligner platform for wafers up to 200mm that set standards in respect to alignment accuracy, high resolution, 3D patterning over topography and a high level of automation.
The MA200Compact combines proven mask aligner technology with a variety of innovative features that make it the system of choice for thick resist MEMS applications (i.e. Inkjet Heads, accelerometers, HDD), Advanced Packaging (i.e. 3D-packaging, fan-out, WLP, bumping), Compound Semiconductor (i.e. HBLED) and Micro Optics (i.e. Wafer Level Camera).