SUSS SB8e substrate bonder

SUSS SB8e substrate bonder

Wafer bonding for thermocompression, anodic and fusion processes

Salient Features: Pieces and wafers up to 8”, temperatures up to 550°C, force up to 20 kN vacuum to 5E-5 mbar

Specifications: Bonding accuracy 3µ, tempperature uniformity +/- 1%

Categories: Equipment > Wafer Bonding |
Manufacturer: SUSS MicroTec
Model: