With the DSM200 Gen2 SUSS MicroTec introduces the automated metrology tool of choice for all emerging front to backside alignment and overlay applications. The front-to-back alignment verification system is the ideal tool for measuring alignment accuracy on wafers from 2 inch to 200mm.

Incorporating the latest pattern recognition and metrology technology, the DSM200 Gen2 offers the highest measurement accuracy of 0.2um at 3sigma on a fully automated platform with minimized operator intervention. The system provides overlay and IR metrology capability to complete typical measurement requirements in the field of MEMS, LED and 3D packaging.

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