MEMS Foundry Services
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MEMS Foundry Services

Industry segment served (volume): Mostly high-volume, low-volume are also welcome.

Supported Wafer Sizes/Materials: Six inch silicon and glass process.

Processes Employed:

  • Standard MOS process
  • Wafer bonding
  • Deep silicon etch (ICP and KOH)
  • Electroplating
  • Inspection
  • Basic testing

Categories: Advanced Materials > Bonding Material | Glass Wafers | Quartz Wafers | Silicon Wafers | Structured Wafers and Substrates |
Equipment > Chemical Vapour Etching (CVE) | Coat Develop and Expose | Deep Reactive Ion Etching (DRIE) Systems | Inductively Coupled Plasma (ICP) | Lithography | Mask Aligner | Mask and Bonder Aligners | Plasma Enhanced Chemical Vapour Deposition (PECVD) | Wafer Bonding | Wet Etch Protection Systems | Wet Processing Systems |
Foundry Services > Design for Manufacturability (DFM) | Low Volume Fabrication | Pilot Services | Prototyping | Volume Production Ramp | Wafer Bonding |
MEMS Devices > Accelerometers | Functional Sensors | Gyroscopes | Microphones | Optical MEMS | Pressure Sensors | Temperature Sensors |
Other > Cleanroom |
Manufacturer: Asia Pacific Microsystems
Model: