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Silicon Deep Reactive Ion Etch (RIE) Dry etching of Silicon substrates: shallow and deep vias and trenches, thru-wafer etches, customizable trench wall profile angles
Process specifications: Flexible per customer requests
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Silicon Deep Reactive Ion Etch (RIE) Dry etching of Silicon substrates: shallow and deep vias and trenches, thru-wafer etches, customizable trench wall profile angles
Process specifications: Flexible per customer requests
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