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Call for Abstracts: Transducers 2015
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11/12/2014 to 1/15/2015
When: Due Date: January 15, 2015, Selected speakers will be notified starting late January.
Contact: Monica Takacs

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MEMS Industry Group® (MIG) invites your company to submit an abstract for consideration as part of the MEMS Industry Track at Transducers 2015 on June 23, 2015 in Anchorage, Alaska. Selected speakers will receive either 15 or 30 minutes to present (as determined by the speaker selection committee) and may be selected to participate on a panel.

To submit your paper, please click here to fill out the form.  


Submission Requirements

  • High-quality abstract (technical or commercial)
  • Abstract must be between 250-500 words


Suggested Abstract Topics

Technical, such as:

  • Introduction of innovative material(s)
  • Wafer Level Packaging (WLP) techniques via wafer bonding 
  • Trends in production from the equipment level perspective 
  • Packaging from a high volume production perspective (microphones, etc) with respect to reliability, stress
  • Packaging trends and new technologies
  • Packaging issues going from university to fabrication of a device (from characterization to volume) – reliability issues, etc. (testing at wafer level vs. into packaging level and all considerations around that)
  • Product engineering considerations
  • Systems engineering/systems integration
  • Device integration
  • Testing strategies
  • Cost of testing, cost of physical stimulation, cost of temperature (using or avoiding depending on market) – what can be yielded out vs designing in (testing for yield vs testing for characterization)
  • Use of aluminum nitrate deposition in volume production (advantages, challenges…) 
  • DRIE – fundamentals overview (input variables, control…)
  • Etching over cavities (studying in non-ideal conditions) - how does this affect yield, cost, competitive advantage
  • Glass/Quartz etching
  • Thin film transfer techniques
  • Motion sensing applications - ex: multi-axis sensors
  • Technical challenges that are facing MEMS industry today & actions being taken (any breakthroughs?)
  • “CAD for MEMS”  - strategies for design for manufacturability
  • ALD – Secrets of Atomic Layer Deposition –  when it deposits on some surfaces and not on others; how is this used as a competitive advantage (anti-stiction coatings)
  • New materials – nanomaterials…and application of new materials (how being used now – recently commercialized)

Commercial topics, such as:

  • Technology transfer – lessons learned
  • New product introduction
  • Arc of MEMS product development 
  • Educating the customer
  • Considerations for start-up – lab to fab issues
  • Standardization of performance standards
  • Technology development protocols 
  • Production and Six Sigma (SPC – statistical process control) considerations for manufacturing (gyro ex) – case study on volume production and its effect on device performance ; its importance when developing new products
  • Infrastructure development and maturity; customer collaboration (teaching customer model) and market timing
  • Manufacturing – what real volumes look like,  state of the art tools, capacity of a fab 
  • Product Costing Exercise – Yield targets, Reverse costing 



Special thanks to the Speaker Selection Committee


Gary Fedder, Carnegie Mellon University

Jim Knutti, Ph.D., Acuity, Inc.

Tina Lamers, Ph.D., Akustica

Valerie Marty, HP

Rob O'Reilly, Analog Devices

Eric Pabo, EV Group

Magnus Rimskog, Silex Microsystems

Jason Tauscher, Microvision

Jason Weigold, Ph.D., MEMStaff

Carolyn White, Ph.D., AM Fitzgerald & Associates




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