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IMAPS - 12th International Conference and Exhibition on Device Packaging
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3/14/2016 to 3/17/2016
When: 3/14/2016
Where: WekoPa Resort and Casino
Fountain Hills, Arizona 
United States
Presenter: IMAPS

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The 12th Annual Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


Click here to register!

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