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Call for Papers: MEMS & Sensors Industry Group Conference Asia 2016
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3/22/2016 to 4/29/2016
When: Tuesday, March 22, 2016

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 MEMS & Sensors Industry Group Conference Asia 2016



What:  The MEMS & Sensors Industry Group Conference Asia : The Internet of MEMS and Sensors Today, and the Internet of TSensors Tomorrow

When:  September 12-14, 2016

Where: Shanghai, China

Submission Deadline:  Friday April 29, 2016

Speaker Notification: Week of May 1, 2016

Call for Speakers: 

As the commercialization of MEMS and sensors has become ever more present, companies are positioning themselves as both hardware and software providers, whereby they are not just selling chips, but also the algorithms and sensor fusion to simplify system integration, maximize value, and remain competitive.  Sensor companies are also looking to exploit the data analytics of the sensor data and participate in that revenue potential tooAdditionally, the impending demand of the Internet of Things/Everything (IoT/E) for connected devices will usher in the era of TSensors to meet the increasing need for new sensors, form factors and ultra-high volumes.

Organized and hosted by the MEMS & Sensors Industry Group, the trade association focused on advancing MEMS and sensors across global markets, this two-day conference includes a full-day factory tour at a leading Chinese MEMS and sensor company. 

At this conference, you will gain a clear understanding of the MEMS and sensors industry’s unique perspective on the current landscape both near term and longer term with detailed insight into new and emerging applications.


We are seeking speakers to address the following topics:

Challenges and opportunities for success with MEMS and sensors in following the vertical markets:


·         consumer

·         agriculture

·         health/wellness

·         automotive

·         industrial

·         environmental

·         energy


Also the key technologies driving and enabling adoption and integration of MEMS and sensors, including:


o   ultra low power systems

o   smaller form factors

o   flexible and printed electronics

o   data analytics

o   sensor security

o   advanced packaging and test



All selected speakers will receive discounted admission to the MEMS & Sensors Industry Group Conference Asia.  No other compensation will be provided.  Accepted speakers will be required to sign and submit a speaker agreement, provide a bio and headshot by May 15, and provide an electronic copy of their presentation by October 20, 2016. All selected speakers understand by submitting that their final presentation will be available in PDF format to attendees of the conference and to MSIG members in the MSIG Resource Library.  Preference will be given to abstracts that clearly outline a path forward and articulate a call-to-action. 

Thank you for considering a speaking role. We look forward to receiving your abstract!  Please let me know if you have any questions.  Click here to access the submission application.


Click here to submit your abstract!

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