MEMS Executive Congress Europe
March 20, 2012
Hotel Novotel Zurich Airport Messe
An executive forum promoting the commercialization of MEMS
MEMS and the Changing Automobile
MEMS is opening up a whole new world of possibility for transportation—and European companies such as Audi and BMW are leading the charge. After a dip in production during the recent recession, the automotive industry is now leaner and meaner—and manufacturers are poised to differentiate themselves through new safety, energy-efficiency and performance features. As part of its first MEMS Executive Congress in Europe, MEMS Industry Group (MIG) will join automotive suppliers, MEMS manufacturers, and a top market analyst in a panel discussion on the role of MEMS in the changing automobile.
What can we expect from tomorrow’s automotive safety systems and what role is MEMS likely to play?
How is MEMS enabling more energy-efficient cars?
While recent growth in automotive has been fueled by demand from BRIC (Brazil, Russia, India, China) countries, automotive manufacturers in these countries are not yet utilizing MEMS to the same degree as their European, Asian and North American counterparts. How will this affect the overall worldwide adoption of MEMS for automotive safety, energy-efficiency and performance?
Please join us March 20, 2012, 11:15 a.m.-12:00 p.m., for the panel, MEMS and the Changing Automobile.
Moderated by Jiri Marek, senior vice president, engineering sensors, Automotive Electronics Division, Robert BOSCH GmbH, with panelists:
Richard Dixon, Ph.D., Principle Analyst, MEMS & Sensors, IHS iSuppli;
Hannu Laatikainen, executive vice president, Transportation Business, VTI Technologies
Marc Osajda, global automotive strategy manager, Freescale Semiconductor; and
Bernhard Schmid, manager, Sensor System & Technology Center Chassis & Safety Division, Continental Teves AG & Co. oHG.
Platinum Sponsor – EV Group; Gold Sponsors - Applied Materials and SPTS Technologies; Silver Sponsors - Analog Devices and Semefab.
ACUTRONIC, AEPI, A.M. Fitzgerald & Associates, Asia Pacific Microsystems, Bosch, Bosch Sensortec, CEA Léti, CSEM, Freescale Semiconductor, Fries Research & Technology (FRT), GSA, IHS iSuppli, imec, iNEMI, IVAM, Maxim, MST BW: Mikrosystemtechnik Baden-Württemberg, NMI, Okmetic, Smart Systems Integration, Solid State Technology, SVTC and Yole Développement.