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Investment in MEMS/VC  |  Keynote Presentations  |  Market Data  |  MEMS and the 2009 Recession  |  MEMS Business Issues  |  MEMS Commercialization  |  MEMS Equipment  |  MEMS Fabrication  |  MEMS Industry Group Presentations  |  MEMS Integration  |  MEMS Landscape  |  MEMS Packaging  |  MEMS Reliability  |  MEMS Roadmap  |  MEMS Standardization  |  MEMS Test  |  MEMS-enabled products  |  Microtech Conference & Expo 2011  |  MIG Conference Materials  |  Sensors Expo & ESC Chicago 2011  |  Webinars  |  Recordings  |  Smart Systems Integration 2012  |  Smart Systems Integration 2013  |  MEMS Executive Congress Europe 2012  |  M2M Forum 2012: Focus on MEMS New Product Development  |  Sensors Expo 2012  |  MEMS Research  |  BSAC/MIG Fall 2012 Workshop  |  MIG Partner Materials  |  MEMS Executive Congress US 2012  |  2013 CES - MEMS Session & Content  |  MIG Technology Development Protocol (TDP) Template  |  M2M Forum® 2013: Focus on How MEMS is Shaping the Future of Medical Devices  |  Sensors Expo 2013 - Pre Conference  |  Sensors Expo 2013 - Conference Track  |  MIG Presentations  |  BSAC/MIG Fall Workshop 2013  |  MEMS Executive Congress US 2013  |  2014 International CES  |  MEMS Education Series - Live in Scottsdale
Investment in MEMS/VC 
Presentations relating to the investment in MEMS technology
  • A FIVE YEAR PERSPECTIVE OF MEMS INDUSTRIALISATION
    Author: SEAN NEYLON, CHAIRMAN OF NEXUS ASSOCIATION, EUROPE; PRESIDENT, COLIBRYS, INC.
    From MIG's 5-year Anniversary Report. Looking back on the past five years in the MEMS industry has made me realize just how much the industry has advanced in this short time. From whatever angle you look at the business, we can see enormous progress. The journey itself, however, has been extremely arduous and resembles a true roller-coaster ride.
    June 2006
  • INFINITE DEMAND FOR THE UNAVAILABLE
    Author: BY MICHAEL GREELEY, GENERAL PARTNER, IDG VENTURES
    I am often asked “what is the outlook the future from a venture investor’s perspective?” Venture capitalists once again believe that investments being made today will consistently generate superior returns; that has not always been the case in recent history. Earlier this decade many investors were very hesitant to commit to new technologies given all of the uncertainties. Stability has once again returned to the market, companies are able to raise capital, and most importantly there is increasing evidence of liquidity for the private investor.
    June 2006
  • MEMS Executive Congress 10: Boucher-Lensch Associates Presentation
    Author: Robert Lensch, Boucher-Lensch
    Overview of MEMS investment opportunities and activities at MEMS Executive Congress 2010.
    November 2010
  • MOVING MEMS TO MARKET: LESSONS LEARNED
    Author: MEMS Industry Group
    An interview with Nader Najafi, Ph.D. Nader Najafi is CEO of ISSYS, a developer of MEMS-based devices for medical and scientific sensing applications. Founded in 1995, the company is readying multiple products for market launch.
    June 2006
  • Siemens Technology-to-Business Center
    Author: Stefan Heuser, Siemens
    Overview presentation from the MIG/BSAC Joint Thrust Session about Siemens Technology-to-Business center and the investment that they are making in MEMS.
    September 2010
  • Technology Launch from Seed Funding to Liquidity Event
    Author: Tammi Smorynski, Intel Capital
    Presentation from the MIG/BSAC Joint Thrust Session about Intel's investment activities in MEMS.
    September 2010
  • Webinar: MEMS Players: An Analysis of Financial Performance
    Author: Yole Developpement
    Slides from a webinar presented by Yole Developpement. Topics include analysis of financial performance of key MEMS players, MEMS market dynamics, market forecast, trends, investment opportunities, acquisition value of MEMS companies, and consolidation trends.
    September 2009
Keynote Presentations 
Keynote presentations from MIG events
  • MEMS Executive Congress 07: Debiotech
    Author: Frederic Neftel, Debiotech
    Keynote presentation from MEMS Executive Congress 2007. Debiotech showcases their insulin pump, enabled by MEMS.
    November 2007
  • MEMS Executive Congress 07: Energy Harvesting Wireless Sensors for Intelligent Green Buildings
    Author: Jim O'Callaghan, EnOcean
    Keynote presentation given in 2007 about EnOcean's energy harvesting technologies.
    November 2007
  • MEMS Executive Congress 07: GE Sensing and Inspection Technologies
    Author: Brian Wirth, Global Product Manager, GE Sensing
    An overview presentation of ecomagination empowered by MEMS at GE Sensing.
    November 2007
  • MEMS Executive Congress 07: Software Craftsmanship
    Author: Philippe Kahn, Chairman of Fullpower Technologies
    A presentation about how software enables MEMS.
    November 2007
  • MEMS Executive Congress 10: MEMS: An Engine for Profitable Growth
    Author: Rich Dumcombe, Hewlett-Packard
    Keynote Presentation from MEMS Executive Congress 2010 by Rich Dumcombe, Strategist, Technology Development Organization, Imaging and Printing Group, Hewlett-Packard (HP). Rich presents an overview of HP's sensor technology and it's potential growth.
    November 2010
  • MEMS Executive Congress 10: Smart Sensing Opportunities
    Author: Visa Ilderem, Intel
    Keynote presentation from MEMS Executive Congress 2010 given by Vida Ilderem, PhD, Vice President, Intel Labs, Director, Integrated Platform Research Lab, Intel Corporation. Her presentation talks about future of sensing!
    November 2010
  • MEMS Executive Congress 11: Keynote Speaker - Aaron Schulman, Toffler Associates
    Author: Aaron Schulman, Business Director, Toffler Associates
    MEMS Executive Congress 2011 Keynote Speaker presentation: "Shaping the Future: The Drivers of Change"
    November 2011
  • MEMS Executive Congress 11: Keynote Speaker - Per Asberg, IBM Rational
    Author: Per Asberg, Program Director, Client Partnerships, IBM Rational
    Introduction Keynote: MEMS Executive Congress, November 3, 2011 "Accelerating Innovation Through Systems Engineering Best Practices"
    November 2011
  • MEMS Executive Congress 2008: Sun Small Programmable Object Technology ( Sun SPOTs )
    Author: Roger Meike, Sun Microsystems Labs
    Keynote presentation for MEMS Executive Congress 2008.
    November 2008
  • MEMS Executive Congress 2008: Towards New Paradigms of Sensing, Computing and Communication
    Author: Dr. Tapani Ryhänen, Director and Head of Nokia Research Center
    Keynote presentation from MEMS Executive Congress 2008. The presentation focuses on the mobile opportunity and Nokia's research in micro and non technologies.
    November 2008
Market Data 
  • MEMS Executive Congress 11: MEMS Market Overview
    Author: Jérémie Bouchaud, IHS iSuppli
    An overview of the MEMS market and forecast from Jeremie Bouchaud of IHS iSuppli given at MEMS Executive Congress 2011.
    November 2011
  • MEMS Executive Congress 11: Status of MEMS Industry 2011
    Author: Jean-Christophe Eloy, Yole Développement
    An overview of the MEMS market, presented by Jean-Christophe Eloy of Yole Developpement at MEMS Executive Congress 2011
    November 2011
  • MEMS Executive Congress 11: Divorce The PC To Differentiate Your Mobile Experience
    Author: Julie Ask, Forrester Research
    Julie Ask of Forrester Research presents on the Market Analyst Panel at MEMS Executive Congress 2011.
    November 2011
  • MEMS Executive Congress 11: MEMS Executive Congress Semiconductor and MEMS Market Outlook
    Author: Tony Massimini, Semico Research
    Tony Massimini, Chief of Technology, Micrologic, Semico Research presents on the Market Analyst Panel at MEMS Executive Congress 2011.
    November 2011
  • Webinar: MEMS Devices Driving Healthcare Application
    Author: Yole
    The webinar provides an overview of the MEMS sensors market for medical applications, trends and emerging technologies.
    November 2011
  • 2007 MEMS Foundry Ranking
    Author: Yole Developpement
    For the 4th year YOLE Développement has published the annual ranking of the MEMS foundries, and there have been major changes since the 2006 ranking! The MEMS foundry business is quite complex with more than 23 companies proposing foun-dry services worldwide. And the field is not static, at YOLE Développement we are seeing new players enter regularly, for example TSMC who recently added a foundry service and will very likely enter our future rankings.
    June 2008
  • A Global Analysis of the Current MEMS Market
    Author: Jeremie Bouchaud, iSuppli
    A Global Analysis of the Current MEMS Market
    July 2011
  • Abstract for MEMS Industry Group, Globalpress Summit 2010
    Author: Yole Developpement
    Yole's presentation includes market forecasts, trends, evolution of market players, and historical acquisition value of MEMS companies.
    March 2010
  • An Industry at an Inflection Point
    Author: Dean W. Freeman VP of Research, Gartner Research
    From the SEMI ISS meeting. An overview of what will drive the semiconductor industry, how it will change semiconductor outlook, forecast, and conclusion.
    January 2011
  • Global Market Share Suppliers of MEMS for Consumer and Mobile Applications
    Author: Jérémie Bouchaud, Director and Principal Analyst MEMS, iSuppli
    Market Share by Revenue in Millions of U.S. Dollars
    January 2009
  • Markets 2011 Highway to the Danger Zone
    Author: Jim Feldhan, Semico Research COrporation
    Market data presentation from the SEMI ISS meeting. Includes Brief Overall Economic Outlook, End Markets/New Markets, and the Outlook for the Semiconductor Industry
    January 2011
  • MEMS Executive Congress 07: Changes in the MEMS Industry
    Author: Jérémie Bouchaud, Director and Principal Analyst MEMS, iSuppli
    Market data presentation from MEMS Executive Congress 2007.
    November 2007
  • MEMS Executive Congress 09: Roger Grace
    Author: Roger Grace, Roger Grace Associates
    Roger Grace's annual report card of the MEMS industry and future opportunities.
    November 2009
  • MEMS Executive Congress 07: Yole Presentation
    Author: Yole Developpement
    Market data presented by Yole at MEMS Executive Congress 2007.
    November 2007
  • MEMS Executive Congress 10: MEMS Applications Opportunities
    Author: Roger Grace, Roger Grace Associates
    Roger Grace of Roger Grace Associates' presentation and report card of the current state of the MEMS industry given at MEMS Executive Congress 2010
    November 2010
  • MEMS Executive Congress 10: MEMS Back to Double Digit Growth
    Author: Jeremie Bouchaud, iSuppli
    An overview of the MEMS market and forecast from Jeremie Bouchaud of iSuppli given at MEMS Executive Congress 2010.
    November 2010
  • MEMS Executive Congress 10: MEMS Market Overview
    Author: Jean-Christophe Eloy, Yole Developpement
    An overview of the MEMS market, presented by Jean-Christophe Eloy of Yole Developpement at MEMS Executive Congress 2010
    November 2010
  • MEMS Executive Congress 10: MEMS Technology
    Author: Robert Lensch, Boucher-Lensch
    Boucher-Lensch Associates LLC - 0n the cusp of the 2010s, MEMS is hitting a “young adulthood” stage of better focus on market fundamentals and more demand-pull opportunities, even allowing for the current economic crisis. We believe the industry is approaching a tipping point beyond which growth will accelerate, driven by the convergence of new high volume applications, increasing MEMS foundry capacity based on standard building blocks, and the potential for increased venture capital flows into the market.
    November 2010
  • MEMS Foundry Market Overview
    Author: Yole Developpement
    Presentation topics include MEMS foundry infrastructure, top 20 foundries for 2008, annual growth rate, and the MEMS foundry market.
    January 2009
  • MEMS Industry Indicators 2008
    Author: Yole Developpement
    Forecast of the MEMS market to 2012. From a historical perspective, it's interesting to see if the MEMS industry has grown at the rate expected.
    July 2008
  • MEMS Manufacturing Evolution
    Author: Jean-Christophe Eloy, Yole Developpement
    Jean-Christophe Eloy presented at MEPTEC's MEMS Symposium about trends in manufacturing, packaging, and integration.
    May 2010
  • MEMS Market Brief
    Author: iSuppli
    Includes low power in consumer accelerometers, inertial sensors, equipment, and a teardown of the Sony Ericcson music phone.
    May 2009
  • MEMS Market Brief: October 2008
    Author: iSuppli
    Monthly brief of the MEMS Market includes Tronics, ADI, Motorola, Apple, and industrial sensors.
    October 2008
  • MEMS Market Perspective
    Author: Jean-Christophe Eloy, Yole Developpement
    From MIG's 5-year anniversary report. An overview of the MEMS industry.
    June 2006
  • MEMSCAP Company Analysis
    Author: Yole Developpement
    An company analysis of MEMSCAP.
    December 2009
  • METRIC 09: How Hard does the Crisis hit the MEMS Industry?
    Author: Jérémie Bouchaud and Dr. Richard Dixon, iSuppli
    A MEMS market presentation compiled for METRIC 2009: Focus on Growth in a Changing Economy.
    March 2009
  • METRIC 09: MEMS Industry Indicators 2009
    Author: Yole Developpement
    Includes the top 30 MEMS manufacturers for 2008 and a forecast through 2012.
    March 2009
  • METRIC 09: Survey
    Author: MEMS Industry Group
    Industry wide survey, done as part of research for METRIC 2009, focused on the effects of the economic downturn on the MEMS industry.
    March 2009
  • METRIC 10: Innovations in Manufacturers
    Author: Jérémie Bouchaud, Director and Principal Analyst MEMS, iSuppli
    Presentation from METRIC 2010. Topics include MEMS market overview, price elasticity and price erosion of MEMS, and manufacturing and process trends to cope with price erosion.
    May 2010
  • METRIC 10: MEMS Manufacturing Trends
    Author: Yole Developpement
    Presentation compiled for METRIC 2010. Topics include MEMS market forecast, manufacturing process drivers, evolutionary steps, MEMS process flows, packaging and manufacturing trends, and MEMS and IC integration
    May 2010
  • METRIC 10: Top 20 MEMS Foundries 2007/08
    Author: Yole Developpement
    Graph of the top 20 MEMS Foundries
    May 2010
  • Status of the MEMS Industry 2009
    Author: Yole Developpement
    Topics include update of the MEMS market, MEMS forecast 2009, new applications, and major industrial changes for the MEMS industry.
    July 2009
  • TOP 20 MEMS Foundry ranking - Sales 2010
    Author: Yole Développement
    TOP 20 MEMS Foundry ranking - Sales 2010 (Yole Développement Estimates $M – April 2011)
    May 2011
  • The Diversity of MEMS Inertial Sensor Technology*
    Author: St.J. Dixon-Warren, Chipworks
    Presentation of the silicon-based MEMS market of 2007.
    May 2007
  • Webinar: Consumer MEMS – Downturn? What Downturn?
    Author: Jeremie Bouchaud, iSuppli
    Part of MIG's MEMS Education Series of Webinars. Topics include consumer spending and its effect on the MEMS industry, accelerometers in cell phones, the future of MEMS gyros, microphones, and the next killer app.
    March 2010
  • Webinar: Emerging MEMS: Fueling Growth
    Author: Yole Developpement
    A webinar presented by Yole Developpement on Emerging MEMS markets. Gives forecasting data to 2015.
    March 2010
  • Webinar: Medical, Industry, Aerospace and Energy: Fertile Ground for MEMS
    Author: Jeremie Bouchaud, iSuppli
    From MIG's MEMS Education Series of Webinars. Jeremie Bouchaud from iSuppli discusses MEMS markets for high value applications, energy, and quality of life.
    July 2010
  • Webinar: MEMS: Outsider's View of the Market
    Author: Eric Levy-Myers
    Part of the MEMS Education Series of Webinars, Eric Levy-Myers, Adjunct Consultant at Institute for Defense Analysis (IDA) - Science, Technology Policy Institute (STPI), talks about opportunities for the MEMS industry.
    October 2010
  • MEMS Manufacturing Evolution
    Author: Yole Developpement
    MEMS Market Data prepared for M2M Forum 2011.
    March 2011
  • MEMS Market Overview
    Author: IHS iSuppli
    Market Data prepared for M2M Forum, 2011.
    March 2011
  • MEMS Market Overview: MEMS entered double digit growth cycle
    Author: Jérémie Bouchaud
    •MEMS market and industry overview •Impact of Japan Earthquake on MEMS industry •Consumer and Mobile MEMS full steam ahead •The supplier landscape is changing
    September 2011
  • Yole Développement top 30 MEMS ranking: STMicroelectronics challenges Texas Instruments for top spot
    Author: Yole Développement
    Lyon, France – March 26, 2012 - Top two suppliers close in on $1B sales level, as MEMS market sees 17% growth to pass $10 billion mark.
    March 2012
  • Top 30 worldwide MEMS companies ranking – 2011 Revenues
    Author: Yole Développement
    Illustration: Top 30 worldwide MEMS companies ranking – 2011 Revenues
    March 2012
  • Yole Développement top 20 MEMS foundries: MEMS foundry sector sees 5% growth to over $600 million in 2011
    Author: Yole Développement
    Lyon, France – April 6, 2012 – Sony more than doubles revenues, Silex and Teledyne DALSA pull ahead of rest of the crowd of pure-play independents.
    May 2010
  • Typology of MEMS companies: diagnostic for complete year 2010
    Author: Yole Développement
    (Source : Status of the MEMS Industry report, to be released mid-2012, Yole Développement, March 2012)
    May 2012
  • MEMS market forecast 2010 - 2017 (US$M)
    Author: Yole Développement
    (Source: Status of the MEMS industry report, to be released mid 2012, Yole Développement, March 2012)
    May 2012
  • Typology of MEMS foundries: diagnostic for complete year 2010
    Author: Yole Développement
    (Source : Status of the MEMS Industry report, to be released mid-2012, Yole Développement, March 2012)
    May 2012
MEMS and the 2009 Recession 
  • METRIC 09: Trip Report
    Author: MEMS Industry Group
    METRIC 2009 (www.memsmetric.com) was held in Pittsburgh, PA at the Renaissance Pittsburgh Hotel on March 25-26. Organized by MEMS Industry Group (MIG) (www.memsindustrygroup.org), the topic of the annual members’ meeting was “Growth Opportunities for MEMS in a Changing Economy.” The event included over forty attendees from all links in the MEMS supply chain. METRIC 2009 kicked off on Wednesday evening with a networking reception and keynote speech by Dr. Bill Hawkins, MEMS lab manager at General Electric Global Research. Thursday’s sessions included a panel discussion moderated by Dr. Ken Gabriel, Founder and CTO of Akustica; business and technical working group sessions; and a wrap-up session by the group moderators.
    March 2009
  • METRIC 09: Interview with Wilfried Bair, SUSS MicroTec
    Author: MEMS Industry Group
    An equipment manufacturer's perspective of the economic downturn's effects on the MEMS industry. Topics include challenges, helping customers, changing business strategy, and preparing for the upturn.
    March 2009
  • METRIC 09: Interview with Paul Werbaneth, Tegal
    Author: MEMS Industry Group
    Equipment manufacturer's perspective of the economic downturn's effect on the MEMS industry. Topics include challenges facing the MEMS industry, helping customers, changing strategy, and preparing for the upturn.
    March 2009
  • METRIC 09: Interview with Tom Kenny, Program Manager, DARPA
    Author: MEMS Industry Group
    An interview focusing on how the economic downturn affected DARPA and their funding initiatives.
    March 2009
  • METRIC 09: Top 10 Predictions for 2009 and Implications for High-Tech
    Author: Nariman Behravesh, Chief Economist, SEMI
    From SEMI's 2009 ISS Symposium. An economist's perspective of the 2009 recession.
    January 2009
  • METRIC 09: Interview with Tronics Microsystems
    Author: MEMS Industry Group
    A foundry's perspective of the economic downturn. Topics include challenges, working with customers, and changing business strategy.
    March 2009
  • METRIC 09: Interview with Scott Smyser, VTI Technologies
    Author: MEMS Industry Group
    The economic downturn from a device manufacturer's perspective. Topics include innovation and impacts of the economic recession.
    March 2009
  • METRIC 09: Interview with Dr. Mike Mignardi, Manager, Energy Harvesting, Texas Instruments
    Author: MEMS Industry Group
    Topics include impacts of the economic downturn, changing business strategy, and preparing for the upturn.
    March 2009
  • METRIC 09: PNC National Economic Outlook
    Author: PNC
    General economic outlook for the US economy.
    March 2009
  • METRIC 09: Interview with PRTM
    Author: MEMS Industry Group
    Interview with Roger Wery and Aritomo Shinozaki, PRTM. Topics include their perspective of the MEMS industry, impact of the economic downturn, targeting investments, and recommendations for the MEMS industry.
    March 2009
  • METRIC 09: Interview with Chris Lumb
    Author: MEMS Industry Group
    Topics include, impact of the economy from a foundry's perspective, challenges caused by the downturn, working with customers, changing business strategy, and preparing for the upturn.
    March 2009
  • METRIC 09: Attendees
    Author: MEMS Industry Group
    A list of people who attended METRIC 2009.
    March 2009
  • METRIC 09: Interview with Warren Packard, Draper Fisher Jurvetson
    Author: MEMS Industry Group
    An investor's perspective of the MEMS industry. Topics include the impact of the economic downturn, MEMS reputation for a long product development cycle, business strategy, and preparing for the upturn.
    March 2009
  • METRIC 09: Drivers and Barriers to Making the 8in Transition
    Author: PRTM Management Consultants
    Key learnings from a study sponsored by Applied Materials and SVTC. The purpose of the study was to understand customer perspectives on the drivers and barriers associated with the transition to 8" wafers.
    December 2008
  • METRIC 09: Recent Articles
    Author: MEMS Industry Group
    A compilation of articles related to the economic downturn of 2009 and the MEMS industry.
    March 2009
  • METRIC 09: Interview with Buddy Hobart, Solutions 21
    Author: MEMS Industry Group
    Solutions 21 is a business consulting firm. The interview focused on an overview of the economic downturn and how it's affecting the world economy and how companies may weather through difficult times.
    March 2009
  • METRIC 09: Stimulus Highlights
    Author: Tim Murphy
    Highlights of the 2009 US federal stimulus package.
    January 2009
  • METRIC 09: Summary and Closing Thoughts
    Author: Karen Lightman
    Closing presentation from METRIC 2009, Focus on Growth in a Changing Economy
    March 2009
  • METRIC 09: Product Innovation & Market Innovation
    Author: Mike Mignardi, Texas Instruments and Anna-Riikka Vuorikari-Antikainen, Okmetic
    Working group summary from METRIC 2009. Topics include innovation strategies and areas for growth.
    March 2009
  • METRIC 09: Business Strategies
    Author: Raffaelle Borzi, IMEC and Jennifer MacDonell, Endevco MEMS
    Working group summary from METRIC 2009. Topics include Marketing and Strategy issues to weather the economic downturn and be well-positioned and strong in the recovery. The focus was on reducing costs, product development challenges, and opportunities for growth.
    March 2009
  • METRIC 09: Equipment and Material Challenges in Lean Times
    Author: Amy Duwel, Draper Laboratory and Michelle Bourke, Kilbrydon Consulting
    Working group summary from METRIC 2009. The group focused on the future needs of the industry in regards to equipment and materials. Discussion focused on the types of materials that device manufacturers are looking for to lower developmental costs and well as metrology techniques and other needs.
    March 2009
  • METRIC 09: Technical Challenges in the Product Development Cycle
    Author: Tina Lamers, Avago Technologies & Rich Allen, NIST
    Summary presentation from the above mention working group. Topics include early stage definition, design, processes, volume production, including early stage definition, design, processes and volume production.
    March 2009
  • METRIC 09: Growth in an Era of Uncertainty
    Author: Nick Konidaris President and CEO, ESI, Inc.
    Presentation given at SEMI ISS 2009. Focuses on the strategies for growth during a recession. Topics include a historical perspective, causes of the recession, and the recession's effects on the semiconductor industry.
    January 2009
  • METRIC 09: Interview with Jason Weigold, CEO, MEMStaff
    Author: MEMS Industry Group
    An interview that focuses on the economic impacts on the MEMS workforce and how companies may prepare for the upturn.
    March 2009
MEMS Business Issues 
  • Cycles come and go, innovation never stops
    Author: Andy Bryant Executive Vice President Chief Administrative Officer
    From SEMICON West, this presentation outlines Intel's investment mandate, evolving business models, and supply chain excellence.
    July 2010
  • MEMS AND THE PERILS OF PERCEPTION: DISRUPTION VS. INNOVATION
    Author: MEMS Industry Group
    An interview with Jeffrey R. Williams, Ph.D. Professor of Business Strategy, Carnegie Mellon Graduate School of Industrial Administration
    May 2009
  • METRIC 10: Scaling New Heights
    Author: G Dan Hutcheson, weSRCH
    A presentation about emerging applications and business models in green tech, medical and high technology. This presentation was part of the materials given to attendees of METRIC 2010; Focus on MEMS Fabrication.
    May 2010
  • MEMStaff COMS 2010 Presentation
    Author: Jason Weigold, MEMStaff
    A presentation about MEMStaff and the services they provide.
    September 2010
  • Evolution and Acquisition of Talent in the MEMS Industry
    Author: Jason Weigold and Kevin Chau, MEMStaff
    White paper about how to obtain the best talent in the MEMS industry.
    September 2010
  • From Gigahertz To Systems To Solutions
    Author: Dr. Bernard S. Meyerson – IBM Fellow Vice President - Innovation
    An overview of IBM's innovation strategies to meet global challenges, including MEMS.
    July 2010
  • Industry Report 2009: Focus on Growth Opportunities for MEMS in a Changing Economy
    Author: MEMS Industry Group
    From METRIC 2009, MIG's industry report focuses on business strategies, product definition and market innovation, technical challenges in the product development cycle, and equipment and material challenges in lean times.
    May 2009
MEMS Commercialization 
  • Bridging the Chasm from Idea to Production
    Author: Bert Bruggeman, CEO, SVTC Technologies
    From the MIG/BSAC Thrust Session on MEMS commercialization, this presentation includes the topics of Si Scaling, the evolution of MEMS manufacturing, emerging MEMS, and developmental models.
    September 2010
  • Enabling MEMS from Development to Production on 200mm Wafer Processing
    Author: Wilbur Catabay, SVTC
    Presentation about SVTC's capabilities on 200 mm wafers at MEPTEC's MEMS Symposium.
    May 2010
  • MEMS Technologies Dresden
    Author: HaraldSchenk/ Michael Müller/ Johannes Kade, Fraunhofer IPMS
    An overview of Fraunhofer's R&D to Pilot-fabrication business model and services.
    April 2010
  • MEMS: Ready or Not An interview with Sam Kogen, Ph.D
    Author: MEMS Industry Group
    Sam Kogan gives his insight on the evolution of the MEMS industry and offers some observations on the bigger picture.
    January 2005
  • Planning for Successful MEMS Product Development
    Author: Alissa Fitzgerald
    This article provides some guidance to newcomers on how to plan appropriately for a MEMS product development effort. Our firm, A.M. Fitzgerald & Associates, located in Burlingame, California, provides MEMS product development services.
    August 2011
  • MEMS Product Development: Why Is It So Hard?
    Author: Alissa M. Fitzgerald, Ph.D.
    Presentation from MEMS Commercialization Workshop at BSAC on 9/22/2011.
    September 2011
  • The Future of Sensors: MEMS and ASICs
    Author: Vijay Ullal
    Vijay Ullal, Group President Consumer Solutions Group, Maxim Integrated Products gives keynote at BSAC conference Sept 2011
    September 2011
  • Mainstreaming of MEMS: One Example – Texas Instrument’s Digital Micro-mirror Device for Display Applications
    Author: Patrick (Rick) Oden, Ph.D.
    Patrick (Rick) Oden, Ph.D. Distinguished Member Technical Staff – DLP® Products, Texas Instruments, Inc. at BSAC MEMS Workshop Sept 2011
    September 2011
  • Commercialization of MEMS Motion Sensors in the Past Decade
    Author: Jay Esfandyari
    Jay Esfandyari, MEMS Product Marketing Manager, STMicroelectronics - BSAC MEMS Workshop Sept 2011
    September 2011
  • MEMS Executive Congress 11: Applied Materials, Introduction to Thursday afternoon keynote speaker
    Author: Dr Michel (Mike) Rosa, Applied Materials
    Introduction to keynote speaker of MEMS Executive Congress 2011.
    November 2011
  • MEMS Executive Congress 11: STMicroelectronics, Introduction to MEMS Sensor Fusion panel
    Author: Benedetto Vigna, STMicroelectronics
    Introduction to MEMS Sensor Fusion panel at MEMS Executive Congress 2011.
    November 2011
  • EPSON IMU Introduction
    Author: Epson Electronics America, Inc.
    EPSON IMU Introduction (S4E5A0A0)
    May 2011
  • Sensors in Design 2012: MEMS IN SPORTS, Syride
    Author: Romain Lazerand
    Panel presentation from Sensors in Design 2012 - MEMS in Sports. Syride brings MEMS technology to surfing analytics.
    April 2012
  • Sensors in Design 2012: MEMS in Sports, Xsens
    Author: Per Slycke, Xsens
    Panel presentation from Sensors in Design 2012 - MEMS in Sports. Xsens, Leader in 3D motion tracking.
    April 2012
  • Sensors in Design 2012: MEMS in Sports, Analog Devices
    Author: Rob O’Reilly, Analog Devices Inc.
    Panel presentation from Sensors in Design 2012 - MEMS in Sports. Analog Devices Inc., MEMS Sensors and Technology Group
    April 2012
  • 1965-1975 Westinghouse MEMS Research: How it shaped the MEMS of today and tomorrow
    Author: Dr. Harvey C. Nathanson, Chief Scientist, Advanced Materials and Semiconductor Devices Center, Northrop Grumman Corporation
    Original Work on MEMS at the Westinghouse Research Laboratories in Pittsburgh, PA during the Period from 1965 through 1975.
    June 2012
MEMS Equipment 
MEMS Fabrication 
  • Current Trends with DRIE/DSE™ Processing for MEMS Devices and Structures
    Author: Plasma-Therm
    Whitepaper Topics: MEMS, sensors, DRIE, DSE, Bosch process, dry etching, plasma etching, fab process equipment, 3D silicon structures, SOI, TSVs.
    September 2012
  • 7 Mistakes People Make Developing MEMS Products
    Author: Chris Lumb, Micralyne
    Mistakes that companies should avoid when fabricating a MEMS product.
    January 2008
  • A Customer's View of GLOBALFOUNDRIES
    Author: Norm Armour, Vice President & General Manger, Fab 8, GLOBALFOUNDRIES
    From the SEMI ISS meeting. This presentation gives an overview of the history of GLOBALFOUNDRIES, where they are today, and where they are going.
    January 2011
  • Best Known Practices: Mistakes People Make Developing MEMS Products
    Author: Chris Lumb, Micralyne
    This BKP (Best Known Practice) describes seven of the common MEMS product development mistakes and what you can do to avoid them. MEMS product development is easy to visualize but difficult to do well. While primarily based on common sense, we hope this document will help you in your product developments.
    October 2009
  • From Wafer to Wii, the Story of MEMS Fabrication
    Author: MEMS Industry Group
    Overview presentation given at the MEPTEC MEMS Symposium by MEMS Industry Group about the findings at METRIC 2010.
    May 2010
  • Industry Report 2003: Focus On Fabrication
    Author: MEMS Industry Group
    MIG's industry report based on research and the findings at METRIC 2002. Includes a now historical look at the VC's perspective of MEMS, design for manufacturability, standardization, and economics.
    February 2003
  • METRIC 10: An Interview with SVTC
    Author: MEMS Industry Group
    An overview of SVTC's commercialization services and how a customer should select a foundry.
    May 2010
  • METRIC 10: Articles
    Author: MEMS Industry Group
    A compilations of articles about MEMS fabrication.
    May 2010
  • METRIC 10: Case Study: Automotive MEMS Pressure Sensors
    Author: MEMS Industry Group
    A case study about an automotive MEMS manufacturer and how they chose their foundry partner.
    May 2010
  • METRIC 10: Foundry Business Model
    Author: John McKillop, Tekton Consulting and Tom Chang, Asia Pacific Microsystems
    The Captive Fab, Fab-lite vs. Fabless working group will explore the benefits, pitfalls, and tradeoffs of each model. The group will discuss the cost of ownership of a fab versus fabless options with respect to the issues of low volume/concept development , process and volume.
    May 2010
  • METRIC 10: Fraunhofer Pilot-Fabrication and Foundry Services
    Author: Harald Schenk/ Michael Müller/ Johannes Kade, Fraunhofer IPMS
    An overview presentation of foundry services at Fraunhofer IPMS.
    May 2010
  • METRIC 10: Interview with AM Fitzgerald
    Author: MEMS Industry Group
    This interview offers advice on how to select a foundry, effective communication, tech transfer, and fabrication trends.
    May 2010
  • METRIC 10: Interview with Bob Basnett, Semiconductor Support Services
    Author: MEMS Industry Group
    A discussion about how refurbished semiconductor equipment may help you save in fabrication cost.
    May 2010
  • METRIC 10: Interview with DALSA
  • METRIC 10: Interview with Jeff Hilbert, WiSpry
    Author: MEMS Industry Group
    WiSpry is a fabless product company fielding tunable components for high-volume low-cost RF systems such as mobile terminals. Our initial customers include both mobile terminal OEMS and their module and chip-set suppliers. We partner with mainstream CMOS foundries to implement our proprietary MEMS designs into their manufacturing flows to create monolithically integrated chips including electronics, MEMS and wafer-level encapsulation on the same die.
    May 2010
  • METRIC 10: Interview with Qualtre
    Author: MEMS Industry Group
    Founded in 2007, Qualtré is a fabless MEMS motion sensor company. Their technology platform is enabled by process research done at the Georgia Institute of Technology’s renowned Integrated MEMS Laboratory. This platform makes possible a unique multi-axis gyroscope created high frequency Bulk Acoustic Waves (BAW). Their gyroscope design and process platform provide a pathway to integrate with other components (like accelerometers). They are focused on high-volume consumer motion applications, including gaming, mobile phones, navigation devices, and image stabilization for cameras. Qualtré’s goal is to bring to market a gyroscope in a form factor and price point that is attractive to consumer electronics OEMs. Their MEMS device does not use CMOS, but bonds a companion chip that is CMOS compatible.
    May 2010
  • METRIC 10: Interview with Silex Microsystems
    Author: MEMS Industry Group
    An interview with Silex Microsystems that focuses on the foundry customer relationship, tech transfer, and recent fabrication trends.
    May 2010
  • METRIC 10: MEMS at Bosch
    Author: Bosch
    An overview of MEMS activities at Bosch.
    May 2010
  • METRIC 10: New Opportunities for MEMS Fabrication
    Author: David Buckley, Micralyne and Eric Pabo, EV Group
    Working group summary. Topics include diversity of applications, limited awareness of DFM reality, hybrid integration, and DFT.
    May 2010
  • METRIC 10: No More "Fear Factor" - Understanding MEMS Fabrication
    Author: MEMS Industry Group
    In the past, the ‘fear factor’ of MEMS’ complex fabrication processes restricted the widespread adoption of MEMS in many markets. Today, however, MEMS’ fabrication is keeping pace with market demand for mass-produced MEMS devices which are being fabricated in the millions. Early commercial successes in inkjet print heads and automotive air bags have given rise to widespread adoption in mobile handsets, video game hardware, laptop computers and reams of new automotive applications.
    May 2010
  • METRIC 10: Paper Search
    Author: MEMS Industry Group
    A compilation of technical papers on MEMS fabrication.
    May 2010
  • METRIC 10: Technical Challenges in Optimizing MEMS Fabrication
    Author: Eric Lautenschlager, Knowles and Chris Milne, Honeywell
    Working group summary. The Technical Challenges in Optimizing MEMS Fabrication working group will focus on issues including design evolution and the general characteristics of multi-generational designs; cost considerations of wafer size, testing, materials; hunting “yield killers;” and the tradeoffs between using silicon vs. other substrates.
    May 2010
  • METRIC 10: Working with a Foundry
    Author: Harry Engwer, SSS and Magnus Rimskog, Silex Microsystems
    The Working with a Foundry working group will discuss typical foundry business models and the associated volume and cost considerations. The group will also delve into the elements to a successful partnership, processes (standard vs. non-standard, design rules), and improving transparency in foundry specifications.
    May 2010
  • METRIC 10: Wrap-up and Summary
    Author: MEMS Industry Group
    Wrap-up of the discussions about MEMS fabrication at METRIC 2010.
    May 2010
  • Micro and Nano R&D Fab Performance and Productivity: A Lean Six-Sigma Approach
    Author: R. J. Olson, Jr., W. Hawkins, P. Piacente, R. Frank, J. Deluca, L. Douglas, and G, Trant, General Electric
    A lean six-sigma approach was utilized to improve the performance of a multi-technology R&D cleanroom facility at GE’s Global Research Center (GRC). The lean initiative prioritized 4 areas for improvement: 1) fab loading and lot priority, 2) documentation, 3) equipment and, 4) maintenance. A set of four metrics (throughput, uptime, process time, and lot queue time) for each piece of equipment was utilized to measure and drive cleanroom operational performance improvements. Subsequent activities relied on more sophisticated analysis of these metrics as a basis for prioritizing additional improvement tasks. Projects that improved the data management systems, and lot process documentation were also completed.
    March 2009
  • The Centrality of Silicon: How Semiconductors are Driving the Next Wave of Innovation
    Author: Gregg Bartlett Senior Vice President, Technology and Research & Development, GLOBALFOUNDRIES
    A presentation given at SEMICON West outlines why chip innovation is as critical as ever, how to overcome technical challenges, and collaboration.
    July 2010
  • Trends in Wafer Bonding
    Author: Dr. Shari Farrens, SUSS MicroTec
    Presentation given at SEMI about MEMS technology trends, MEMS market forecast, technology positioning, bonding (new metals), eutectic reactions, precision bond mechanics, and packaging.
    January 2008
  • Video: Intro to MEMS
    A descriptive video showing the basics of MEMS technology.
    June 2008
MEMS Industry Group Presentations 
Presentations given by MIG staff at industry events.
MEMS Integration 
  • An Approach of RF-MEMS Technology Platform For Multi-band Multi-mode Handsets
    Author: DelfMEMS: Christophe Pavageau, Olivier Millet, Ariel Cao
    Overview of key concepts: Multi-band multi-mode mobile handset trends Reconfigurable RF hardware Low voltage, high speed RF-MEMS switch Technology platform for high-volume production SoC integration of RF-MEMS
    February 2011
  • Industry Report 2007: Focus on MEMS Integration
    MIG's industry report from METRIC 2006. Topics include IC compatible manufacturing, wafer level encapsulation, integrating MEMS into wireless applications, packaging, integrating MEMS into systems, and business decisions.
    January 2007
  • Integrated RF-CMOS MEMS Solutions for Mobile Applications
    Jeff Hilbert from WiSpry gave a presentation at MEPTEC's MEMS Symposium about integration solutions for mobile applications.
    May 2010
  • Integrating MEMS with DSP/Microprocessors: Thoughts from the MEMS Ecosystem
    Author: Karen Lightman, others
    Embedded Systems Conference Silicon Valley
    April 2011
  • Integration Benefits and Approaches for Micromechanical RF Circuits
    Clark Nguyen of BSAC gave this presentation at MEPTEC's MEMS Symposium about when integration makes sense, MEMS-Last integration, and single-chip MEMS-based oscillators.
    May 2010
  • MEMS Integration Strategies
    John Heck from Intel gave this presentation at MEPTEC's MEMS Symposium. Topics include MEMS-CMOS integration examples and motivations and examples of their applications at Intel.
    May 2010
  • MEMS PROCESS INTEGRATION: SUCCESSFULLY MEETING CUSTOMER DEMANDS THROUGH CHANGING TIMES
    Author: MEMS Industry Group
    A case study on MEMS integration prepared by MIG based on interviews with MEMSCAP and Boston Micromachines.
    September 2006
  • MEMS, CMOS and Multichip Integration
    Author: MEMS Industry Group
    Working group summary from METRIC 2006.
    September 2006
  • MEMS-Based Systems Solutions: Selected Case Studies
    Roger Grace of Roger Grace Associates presented his views on the business side of MEMS integration at MEPTEC's MEMS. Topics include functional requirements, situational analysis, commercialization, drivers for adoption, research methodology, success factors, and case studies.
    May 2010
  • METRIC 10: Thinking Outside the Chip
    Author: Roger Grace, Roger Grace Associates
    Article written about MEMS and their part in the total system solution.
    May 2010
  • Next Frontier for MEMS-IC Integration
    Sandia National Laboratories presentation on drivers for integration, a review of Sandia's AIN Micro-resonator Technology and the challenges therein.
    May 2010
  • SiGe on MEMS: A Monolithic Approach to Integration
    Raffaella Borzi of IMEC presented at MEPTEC's MEMS Symposium. Topics include MEMS-CMOS integration, IMEC's platform for integration, and a case study that showcases its success.
    May 2010
  • Smart Partitioning Adds Customer Value
    Rob O'Reilly from Analog Devices gave this presentation at MEPTEC's MEMS Symposium. Topics include smart partitioning, growth of MEMS inertial sensors, monolithic integration, package level multi-chip designs, package level integration, and high performance MEMS.
  • Technologies for a small scale co-integration of MEMS and ASIC in vacuum WLP
    Fraunhofer ISIT's presentation from MEPTEC's MEMS Symposium. Topics include MEMS inertial sensors, Surface Micromachining Process, Evolution of MEMS packaging, DAVID project frame, and C2W versus W2W approach.
    May 2010
MEMS Landscape 
  • Industry Report 2007: MEMS Landscape
    MIG's industry report based on research and discussions from METRIC 2007. Topics include getting to high volume, and working with foundries and equipment manufacturers. Specific industry-specific challenges are also outlined, including medical, telecom, entertainment, and defense/homeland security.
    August 2007
MEMS Packaging 
  • Robust Process Solutions for MEMS Flip-Chip Applications With Medium Density Lead-Free Solder Interconnects
    Author: David DiPaola
    MIG Guest Editorial in Chip Scale Review featuring David DiPaola.
    January 2013
  • Aligned Fusion Wafer Bonding for Wafer-Level Packaging and 3D integration
    A white paper written by Thorsten Matthias, Viorel Dragoi, Paul Lindner of EV Group. Abstract: Wafer-level packaging via wafer bonding allows smaller and thinner packages, improves the yield due to higher leanliness, enables the encapsulation of vacuum or process gas and finally reduces the packaging costs significantly. High precision alignment of device wafer to cap wafer allows real chip size packaging as the required width of the sealing rings is in the low micron range. Furthermore different functional subsystems like ASIC and MEMS can be processed on separate wafers thereby reducing the complexity and the number of process steps greatly. Vertical interconnects between the wafers allow 3D integration.
  • Eutectic Metallurgies for MEMS Applications
    Shari Farrens from SUSS Microtec gave this presentation at IMAPS in 2008. Topics include wafer-level packaging, choices in wafer bonding, drivers for eutectic bonding, and bonding reactions.
    March 2008
  • Industry Report 2008: Focus on MEMS Packaging
    MIG's industry report from METRIC 2008. This report includes the topics of backend operations, wafer-level packaging, 3-d integration, testing, and standards.
    May 2008
  • Industry Report 2008: Focus on MEMS Packaging Executive Summary
    Members of the MEMS Industry Group (MIG) met in May 2008 at MIG’s annual members’ meeting - MEMS Technology Roadmap and Industry Congress (METRIC). Members convened to focus on critical issues affecting MEMS packaging; a very timely issue given the recent increase in the adoption and adaption of MEMS. Attendees were divided into five working groups, determined by the METRIC 2008 steering committee, based on areas within MEMS packaging still facing commercialization issues. The goal of METRIC 2008 was to identify critical packaging issues and list potential deliverables, in order to benefit not only MIG members but the industry as a whole.
    May 2008
  • LITHOGRAPHY TECHNOLOGIES FOR WAFER-LEVEL PACKAGING OF IC DEVICES
    Author: Rainer Pelzer, Paul Kettner, Dennis Lee, EV Group
    The roadmap for transistor scaling predicts further increase of circuit complexity, which comes along with higher pin count densities (pins per unit area) and therefore smaller feature sizes. With respect to the continuous reduction in IC feature size and with increased demand for better performance attended with the simultaneous increase of I/O, wafer-level packaging (WLP) and fine-pitch wafer bumping have become a very interesting solution for IC packaging. With WLP and wafer bumping the device packaging and testing processes are performed at wafer level and a subsequent dicing step is cutting the wafer into single chips. After dicing the resulting dies are ready for SMT.
    December 2004
  • MEMS Packaging
    Author: S.W. Lee, ASE Korea
    An overview of MEMS packing from the perspective of ASE Korea. Topics include IC package vs. MEMS package, MEMS packages by applications, challenges in MEMS packaging, examples of characteristic in MEMS packaging, Future of MEMS packaging, MEMS packaging at ASEkr
    May 2008
  • MEMS Packaging Capabilities Enabling Higher Level of IC Integration
    Russell Shumway from Amkor presented MEMS packaging activities and capabilities at Amkor.
    May 2010
  • MEMS Packaging Considerations
    Author: Bob Kuo, Director of Package Development - MEMS, Amkor
    MEMS Packaging overview presentation given at METRIC 2008.
    May 2008
  • MEMS Packaging Survey
    Analysis of the industry-wide survey that MIG conducted as part of the research for METRIC 2008, Focus on MEMS Packaging.
    May 2008
  • MEMS Packaging Trends Some Recent “Real World” Examples
    Sinjin Dixon-Warren from Chipworks demonstrated trends in MEMS packaging including the variety of MEMS packages seen by Chipworks in their reverse engineering.
    May 2008
  • METRIC 08: Device Manufacturer
    Author: MEMS Industry Group
    Interview for METRIC 2008: Focus on MEMS Packaging. This niche device manufacturer was founded out of the university. They created a unique MEMS-based technology that they felt was worthy of commercial product development in a number of different product areas. To this day, they continue to develop their products and enjoy their successes.
    May 2008
  • METRIC 08: Equipment Manufacturer
    Author: MEMS Industry Group
    Interview with Steven Dwyer, Vice President and General Manager North America, EV Group about packaging trends from an equipment manufacturer's point of view.
    May 2008
  • METRIC 08: Foundry
    Author: MEMS Industry Group
    Interview with Silex Microsystems – Magnus Rimskog, Sales Director, North America about packaging from a foundry's perspectives.
    May 2008
  • METRIC 08: Foundry
    Author: MEMS Industry Group
    Interview with Mr. L.C. Peng, Deputy Director, Mainstream Technology Development Division, Dr. Robert Chin-Fu Tsai, Director, MEMS Program, Mainstream Technology Development Division, Dr. Nick Y.M. Shen, Section Manger, MEMS Department, Mainstream Technology Development Division, Dr. Clinton Chao, Deputy Director, Backend Technology Development Division, Backend Technology and Service Division and Dr. Kim Hong Chen, Deputy Director, System Integration Program, Backend Technology and Service Division. Interview focuses on a high-volume foundry's perspective of MEMS packaging.
    May 2008
  • METRIC 08: High-Volume MEMS Device Manufacturer
    Author: MEMS Industry Group
    Interview with Horst Münzel, Vice-President Engineering Sensors for External Customers (AE/ESE), Automotive Electronics, Robert Bosch GmbH Bosch started its MEMS research activities in the 1980’s. In 1988, their Automotive Electronics (AE) division started MEMS product and technology development with the goal to develop a new product field. Bosch rolled out the very first MEMS product in 1993, a pressure sensor for automotive applications. This pressure sensor measures manifold air pressure in a car’s engine. This product is still today manufactured in high-volumes.
    May 2008
  • METRIC 08: Large Device Manufacturer
    Author: MEMS Industry Group
    Interview with Jim McDonald, Manager, Packaging Development, Sensor & Actuator Solutions Division (SASD), Dr. Ray Roop, Strategist, Sensor and Actuator Solutions Division (SASD) Lisa Bradley, Marketing Communications; Freescale Semiconductor. Interview focuses on packaging challenges and lessons learned from the point of view of a high volume device manufacturer.
    May 2008
  • METRIC 08: Large Packaging House
    Author: MEMS Industry Group
    Interview with S.H. Song, Vice President, Business Development, Advanced Semiconductor Incorporated (ASE) Korea. The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. In 1967, the ASE Korean operation was initially started as a Motorola facility. When Motorola started their MEMS business, their operation developed the package in Korea. In 1999, they became ASE, an independent entity.
    May 2008
  • METRIC 08: Niche Device Manufacturer
    Author: MEMS Industry Group
    Interview with Jeff Hilbert – Executive Vice President and Co-Founder, WiSpry who discusses packaging challenges in RF MEMS.
    May 2008
  • METRIC 08: Packagin Solutions
    Author: MEMS Industry Group
    Interview with Adam Schubring, Senior Applications Engineer, Microelectronics Packaging, Kyocera America, Inc. Interview focuses on Kyocera's ceramic packaging solutions and advice for companies about their strategies for MEMS packaging.
    May 2008
  • METRIC 08: Packaging House
    Author: MEMS Industry Group
    Interview with Bob Kuo, Director of Package Development, Amkor. Amkor has a 40-year history providing leading-edge package solutions for the semiconductor industry. It was a natural extension to their business to offer package solutions for MEMS, as their customers entered the MEMS market.
    May 2008
  • METRIC 10: Fabrication Survey
    Author: MEMS Industry Group
    In January 2010, MEMS Industry Group (MIG) launched a survey focused on trends in MEMS fabrication. MIG sent the survey to over 500 individuals and received responses from 63 unique companies. Out of the 63 respondents, 23 considered themselves primarily device manufacturers, nine foundries (and/or packaging, assembly testing houses), seven research organizations, seven equipment manufacturers, six consultants, one user/integrator, and four indicated that they were not involved with MEMS (the survey then concluded for those four companies). MIG undertook this survey to understand the materials, software products, wafer-size, fabrication approaches, processes currently being used by the industry, as well as the fabrication challenges the MEMS industry is still facing.
    May 2010
  • METRIC 2008: Wafer-level and 3-D Integration
    Author: Bill Hawkins, GE and Christine Neuy, IVAM
    Working group summary from METRIC 2008. This group will focus on challenges of packaging at the wafer level. What are the benefits and challenges of wafer-level packaging and is this the future for MEMS packaging? Technical issues in this group will focus on hermeticity and materials challenges.
    May 2008
  • New EDA tools supporting MEMS-ASIC integration schemes
    Sandeep Akkaraju from Intellisense presents the packaging impact on MEMS and challenges in package modeling.
  • Packaging Standards
    From METRIC 2008, this document wraps up the working group discussions about the challenges and benefits of packaging standards. Discussion focused on how the industry may take advantage of off-the-shelf packaging, as well as how to best apply standard semiconductor packaging methodologies to MEMS.
    May 2008
  • Packaging: A Backend Operation
    This is a section from the 2008 MIG Industry Report, Focus on MEMS Packaging. It focuses on the discussions held at METRIC 2008 about strategic sequencing by establishing a three-step process for MEMS–when to singulate, when to package, and when to test. The group focused on backend operations (from wafer to assembly) in an effort to compile a series of best practices.
    May 2008
  • Testing a Package
    From METRIC 2008, this document wraps of the working group discussions about the challenges of testing a MEMS package at the packaged device stage in the manufacturing cycle. The goal of the group was to deliver recommendations to MIG on how it might advance the industry. Topics included qualification/reliability testing, deriving stress acceleration factors, designing for testability, testing per customer specs, communication, and the importance of test.
    May 2008
  • Unique Packaging Styles - MEMS, CMOS, and MultiChip Integration
    This document wraps up the discussion at METRIC 2008 about the growing trend of integrating MEMS with CMOS (particularly foundry compatibility, chip stacking, and multi-chip modulation). Subtopics within the group included die-level vs. package-level integration by technology type, infrastructure, supply chain, and cost/benefit. The group also discussed wafer level MEMS with smart cap, and MIG’s role in advancing MEMS-CMOS integration.
    May 2008
  • Wafer-Level and 3-D Integration
    From METRIC 2008. This paper wraps up the working group discussions on the challenges of packaging at the wafer level. The group discussed the benefits and challenges as well as the future of Wafer Level Packaging (WLP) in MEMS.
    May 2008
MEMS Reliability 
  • Industry Report 2004: Focus on Reliability
    MIG's industry report based on research and the findings at METRIC 2003. Topics include lessons learned from the semiconductor industry, failure modes, standards, customer education, and design.
    April 2004
  • Fracture Prediction of Single Crystal Silicon MEMS Under Multi-Axial Loading
    AM Fitzgerald & Associates describes and validates a new failure prediction methodology specifically designed for single-crystal MEMS devices under general service loadings. The methodology uses experimental data efficiently generated from fracture testing of simple test specimens to calculate a series of Weibull parameters descriptive of specific surface conditions. These data, combined with finite element modeling, are used to predict the fracture load distribution for any MEMS device fabricated by the same process, under any type of loading. We demonstrate the accuracy of our method by comparing predicted fracture probabilities against actual fracture test results for a micro-mirror in two distinct multi-axial loading configurations.
    January 2008
  • MEMS Reliability Survey Analysis
    Author: MEMS Industry Group
    Analysis of a survey conducted by MEMS Industry Group on MEMS Reliability.
    July 2003
  • MEMS Reliability - You Tube
    Author: Allyson Hartzel, Lilliputian Systems
    An interview with Allyson Hartzell about her MEMS Reliability book
    December 2010
MEMS Roadmap 
  • iNemi Roadmap: Executive Summary
    Author: iNemi
    The executive summary of the 2011 iNemi Roadmap. Includes sections on Ink jet printer heads, accelerometers/gyros, rf mems, microfludics, optical mems, pressure sensors, MEMS microphones, CMOS imagers, Resonators, and Emerging Areas.
    March 2011
  • iNemi Roadmap: MEMS Chapter
    Author: iNemi
    The MEMS chapter of the 2011 iNemi Roadmap. Includes sections on Ink jet printer heads, accelerometers/gyros, rf mems, microfludics, optical mems, pressure sensors, MEMS microphones, CMOS imagers, Resonators, and Emerging Areas.
    March 2011
  • Finnish MEMS Technology Road Map
    Author: Toni Mattila & Mervi Paulasto-Kröckel
    A Synthesis of Questionary Responses and Expert Meetings - 14.6.2011
    October 2011
MEMS Standardization 
  • Standardized Sensor Performance Parameter Definitions Version 1.0
    Author: Ken Foust, Sensor Technologist – Intel, Corp. Carlos Puig, Principal Engineer – Qualcomm Technologies, Inc.,
    MEMS Industry Group is proud to bring you this historic document. Recognizing that sensors cannot easily proliferate across vertical and horizontal sectors without standardization, MIG, Intel and Qualcomm Technologies authored and led the creation of this document, which identifies the performance parameter specifications of accelerometers, magnetometers, gyroscopes, pressure sensors, hygrometers, temperature sensors, ambient light sensors and proximity sensors.
    May 2013
  • Standards Currently in Use at MEMS Companies
    Author: MEMS Industry Group
    A spreadsheet compiled by MEMS Industry Group and members to document which standards are currently used at MEMS companies. Prepared for MIG/NIST Testing Standards Workshop
    March 2011
MEMS Test 
  • Executive Summary: MEMS Testing Standards: A Path to Continued Innovation, Report on MEMS Testing Standards Workshop
    Author: MEMS Industry Group
    MEMS Industry Group (MIG) partnered with National Institute of Standards and Technology (NIST) to identify and document device level qualification and testing needs and the results are published herein as a guide to where to focus R&D and standards development for device testing.
    September 2011
  • MEMS Testing Standards: A Path to Continued Innovation, Report on MEMS Testing Standards Workshop
    Author: MEMS Industry Group
    MEMS Industry Group (MIG) partnered with National Institute of Standards and Technology (NIST) to identify and document device level qualification and testing needs and the results are published herein as a guide to where to focus R&D and standards development for device testing.
    September 2011
  • An IMU is an IMU is an IMU
    Author: Sascha Revel, Sales Manager ACUTRONIC USA & Maurus Tschirky, Group Product Manager ACUTRONIC Switzerland
    Prepared for the MIG/NIST Testing Standards Workshop, this presentation covers cost of testing, MEMS inertial Instruments, stages of testing, landscape of IMU applications, managing expectations, UUTs, testing equipment, in-line or off-line testing, and data sheets.
    March 2011
  • An Interview with Kionix
    Author: MEMS Industry Group
    An interview with Scott A. Miller, Ph.D., Vice President of Engineering, Kionix, Inc. Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test. Kionix applies the best practices of the IC semiconductor business and uses industry-standard fabrication equipment and techniques to construct three-dimensional, moving, silicon structures on the scale of modern microelectronics. For high-volume production, we utilize a deep-silicon, proprietary MEMS technology known as plasma micromachining. This technology platform enables Kionix to produce MEMS products that are unmatched in performance and manufacturing cost. We manufacture accelerometers and gyroscopes and our primary market is consumer electronics.
    March 2011
  • An Interview with SoftMEMS
    Author: MEMS Industry Group
    INTERVIEW WITH MARY ANN MAHER, CEO, SOFTMEMS Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test. SoftMEMS is a software company that makes design tools for MEMS-Electronics and Package co-design. Our competitive advantage is that we have a strong understanding of co-design issues and our customers see our software as a key enabler for their products.
    March 2011
  • Concept charts - MEMS
    Author: Acutronic
    Concept slides on testing along the principal MEMS value chain. This document was prepared for the MIG/NIST MEMS Testing Standards Workshop.
    March 2011
  • iMEMS® Test, What’s Different?
    Author: Rob O'Reilly, Analog Devices
    An overview of MEMS testing at Analog Devices.
    January 2009
  • Industry Report 2005: Focus on Accelerated Lifetime Test
    Author: MEMS Industry Group
    MIG's industry report based on research and findings at METRIC 2004. Topics include analytical tools for MEMS analysis; MEMS research, development, and product development cycle; state of the MEMS industry, and a case study on testing the DMDs of Texas Instruments.
    January 2005
  • Interview with Centipede Systems
    Author: MEMS Industry Group
    An interview with Centipede Systems about MEMS Test. Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test. Centipede Systems provides micro-connection technology for electronics operating at the highest levels of density and performance, specializing in advanced burn-in and test. Created in 2003, they provide enabling technology for automating Test-in-Tray applications in MEMS, WLP, and semiconductor devices.
    March 2011
  • Interview with FormFactor
    Author: MEMS Industry Group
    An interview with FormFactor about MEMS Test. Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test. FormFactor was founded in 1993 and offers a portfolio of wafer test solutions for established and emerging semiconductor test applications. They revolutionized the probe card market as the first company to offer a MEMS probing solution. FormFactor's MEMS springs allowed for higher test parallelism as well as an ability to increase yield. Their target market consists of semiconductor manufacturers who need to reduce the cost-of-test. They meet their customers’ needs by providing quality probe cards that greatly increase yield for applications including DRAM, flash memory, and Logic/SOC.
    March 2011
  • Interview with Nanoshift
    Author: MEMS Industry Group
    INTERVIEW WITH SALAH UDDIN, PARTNER, CO-FOUNDER, NANOSHIFT, LLC Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test. Nanoshift is a design and development company specializing in emerging technologies. Nanoshift is known for high quality design and development work, quick turn rapid prototyping and low volume production services
    March 2011
  • Interview with VTI Technologies
    Author: MEMS Industry Group
    An interview with VTI Technologies about MEMS Test. Part of the research for M2M Forum 2011 - Focus on Strategies to Reduce the Time and Cost of MEMS Test.
    March 2011
  • M2M Forum 2011: Working Group 1 - System Level Testing
    Author: Mike Mignardi, Texas Instruments and Magnus Rimskog, Silex Microsystems
    Working group presentation from M2M Forum 2011.
    March 2011
  • M2M Forum 2011: Working Group 2 - Innovations in Testing
    Author: Jim Knutti, Acuity, Inc & Carolyn White, AM Fitzgerald & Associates
    Working Group presentation from M2M Forum.
    March 2011
  • M2M Forum 2011: Working Group 3 - MEMS Testing Standards
    Author: Michael Gaitan, NIST & Eric Levy-Myers
    Working Group presentation from M2M Forum 2011.
    March 2011
  • MEMS Test, What’s Different
    Author: Rob O'Reilly, Analog Devices
    Presentation given at the MIG/NIST MEMS Testing Standards Workshop. It presents an overview of Analog Devices test strategy.
    March 2011
  • MEMUNITY overview
    Author: Wilfried Bauer, Polytec GmbH
    Prepared for the MIG/NIST MEMS Testing Standards Workshop, the presentation gives an overview of the work being done by MEMUNITY, the wafer-level test community.
    March 2011
  • Motion MEMS testing and calibration processes for motion enabled consumer products
    Author: Bruno Flament, Movea
    Prepared for the MIG/NIST Testing Standards Workshop. the presentation gives an overview of Movea and their sensor qualification process.
    March 2011
  • North America MEMS / NEMS Committee - Liaison Report
    Author: Semi
    An outline of SEMI's International Standards. Part of the research materials for the MIG/NIST Testing Standards Workshop.
    March 2011
  • Overview of IEEE Specifications for Inertial Sensors/Systems
    Author: Acutronic
    Specification format guide for the preparation of an inertial device specification and recommended procedures for testing an inertial MEMS device. Prepared for the MIG/NIST MEMS Testing Standards Workshop.
    March 2011
  • Survey Analysis for MEMS Testing Standards Workshop
    Author: MEMS Industry Group
    Survey Analysis for MEMS Testing Standards Workshop
    March 2011
  • Testing for Standards in a NonStandard World
    Author: Steve Wilcenski, MEMSCAP
    Prepared for the MIG/NIST MEMS Testing Standards Workshop, this presentation covers MEMS test challenges and diversity.
    March 2011
  • White Paper: Employing Optical Measurement Techniques for MEMS on Wafer-Level
    Author: Dr. Christian Rembe, Polytec GmbH, Research & Development, Waldbronn,
    Efficient testing of MEMS on wafer level as it is known from integrated electronic circuits is critical to produce reliable and cost-efficient devices. Especially, the geometry and the vibration behaviour contain information that is suitable to identify faulty devices. In addition, it has been demonstrated in the PARTEST project (contract 16SV1934) funded by the German Ministry of Education and Research that vibration data like the resonance frequencies of a mechanical structure can be used to identify system parameters like the Young’s modulus or the density of a deposited material.
    March 2010
  • Addressing the MEMS One Test Dilemma
    Author: David DeRoo, Gary Morrell, Mohamed Elkhamar, Richard Jones, Daniel Nix, Allen Harrison, Greg Dinon, Hugh Miller
  • MEMS Microphone Testing at the Wafer Level
    Author: David DeRoo, Richard Jones, Gary Morrell, Daniel Nix, Hugh Miller
MEMS-enabled products 
Presentations about products using MEMS technology.
  • MEMS in Mobile
    Author: MEMS Industry Group
    Presented in the MIPI Alliance theater at Mobile World Congress 2013, this presentation gives an overview of MEMS in consumer and mobile markets and MEMS standardization efforts.
    February 2013
  • MEMS Everywhere: Enabling a Medical & Healthcare Revolution
    Author: Magnus Rimskog, Sales Director North America, Silex Microsystems; on behalf of MEMS Industry Group
    Presented at the MEMS Engineer Forum 2013 in Tokyo, Japan, this presentation gives highlights of the growing health and medical markets and how MEMS is enabling a consumer healthcare revolution.
    March 2013
  • A Look Inside the Optoma PK101 Pico Pocket Projector
    Author: St.J. Dixon-Warren, Chipworks
    Reverse engineering presentation of the Optoma pico projector including the MEMS inside.
    January 2009
  • BioMEMS market size potential 2005 –2012
    Author: Yole Developpement
    A forecast of the market size potential for BioMEMS.
    January 2008
  • Bridging Photonics & Computing
    Author: Dr. Mario Paniccia, Intel Fellow & Director, Photonics Lab at Intel Corporation
    From SEMI ISS Meeting. Presentation focuses on motivation, electronic & photonic evolution, Intel's research program, integrated sip link, platform applications, and conclusion.
    January 2011
  • Bridging the Chasm from Idea to Production
    Bert Bruggeman, CEO, SVTC Technologies presented on different development models, process, standardization, and case studies.
    September 2010
  • BSAC/MIG Workshop on Path to Commercialization
    John Huggins of BSAC presented different paths to commercialization at the MIG/BSAC Joint Thrust Session.
    September 2010
  • Cleaner, Safer Driving Key to Automotive MEMS Growth
    Author: iSuppli
    A white paper about MEMS in automotive.
    August 2008
  • Globalpress: Where is the Growth in MEMS
    Author: Scott Smyser, VTI Technologies
    Topics of this presentation include sensor and accelerometer evolution in automotive, medical, and consumer.
    March 2009
  • Industry Report 2006: Focus on Technical and Scientific Challenges to Successful MEMS Commercialization
    MIG's industry report based on research and discussions at METRIC 2005. Topics include multi-physics modules at the system level, testing in a multi-domain world, the role of new science, reducing the cost of packaging and integration, material challenges, and the fabless business model.
    January 2006
  • InvenSense: MEMS Start-Up to Market Leader
    Joe Seeger from InvenSense gave this presentation at the MIG/BSAC Joint Thrust Session about the how InvenSense commercialized their MEMS products to become a market leader.
    September 2010
  • MEMS Executive Congress 10: Carnegie Mellon Quality of Life Center
    Article that discusses the Quality of Life Technology Center, enabled by MEMS, at Carnegie Mellon University.
    November 2010
  • MEMS Executive Congress 10: Samsung Pico-Projector
    An overview of MEMS-based pico projector technology by JungKee Lee of Samsung.
    November 2010
  • MEMS Executive Congress 10: Smart Gas Meters & MEMS Technology
    An overview by Liji Huang of Siargo Ltd. of the capabilities of their MEMS-based smart gas meters.
    November 2010
  • Texas Instruments The Evolution to a Lower Cost DMD
    Author: Dr. Kevin Gibb, Dick James, and Dr. St.J. Dixon-Warren, Chipworks
    DLP technology is a fascinating MEMS technology that has an interesting evolution. Originally invented by Dr Larry Hornbeck in 1987, Texas Instruments (TI) developed their Digital Micromirror DeviceTM for cinema projection. It was several years later that the technology saw significant commercial promise as the light engine for DLP HDTV. Here, it has seen strong competition from plasma and LCD alternative technologies. At the same, time the technical and commercial fit for computer projection systems has blossomed. Today, the technology is firmly ensconced as the leading projection technology, and is marching down the path of lower cost, miniaturization.
    January 2009
  • The Art of Motion Sensing Because Motion is Life
    Phillippe Khan of Fullpower Technologies presents his view about how software takes MEMS to the next level.
    May 2010
  • THE SMARTPHONE DISRUPTION
    Author: Björn Ekelund, Head of Ecosystems and Research, ST Ericsson
    From SEMI ISS Meeting, on overview of the mobile phone industry.
    January 2011
  • Use of MEMS Motion Sensors for Embedded Mobile Applications
    Author: Bruno Flament and Yanis Caritou, Movea SA, France
    In this paper, Movea describes the three main components of MEMS motion-enabled products and provides a short review of their capabilities, and limitations. They conclude with the trend for high level motion features is therefore to combine these three sensors so that these MEMS can be put at the service of markets needs.
    March 2011
  • White Paper: TOWARD AN iMoDTM ECOSYSTEM
    Author: Mark Miles, Qualcomm
    The iMoDTM is the basis for a MEMS display that exploits optical interference. QUALCOMM MEMS Technologies (QMT) is engaged in a multi-front effort to commercialize iMoD. This paper will review the history of iMoD development to date, and discuss QMT’s strategy, philosophy, and transformation as it addresses the array of issues it must face to succeed.
  • MEMS Executive Congress 11: MEMS Technology Showcase - Sunrex Air Mini Keyboard
    Author: Thierry Chavigner, Sunrex
    MEMS Technology Showcase 2011 panelist.
    November 2011
  • MEMS Executive Congress 11: MEMS Technology Showcase - Recon Instruments
    Author: Dan Eisenhardt, Recon Instruments
    MEMS Technology Showcase 2011 panelist & showcase winner.
    November 2011
  • MEMS Executive Congress 11: MEMS Technology Showcase - R0R3 Devices
    Author: Jack McCauley, R0R3 Devices
    MEMS Technology Showcase 2011 panelist.
    November 2011
  • MEMS Executive Congress 11: MEMS Technology Showcase - MicroVision
    Author: Jason Tauscher, MicroVision
    MEMS Technology Showcase 2011 panelist.
    November 2011
  • MEMS Executive Congress 11: MEMS Technology Showcase - Syride
    Author: Romain Lazerand, Syride
    (Video: please click to request file)
    November 2011
  • Micro-Design Technologies for Medical Applications Donna
    Author: Donna Sandfox, Medical Market Assistant Sales Manager, Product Manager, MEMS/Sensors/Healthcare Modules, Omron Electronic Components LLC
    Utilizing MEMS in medical devices to minimize, enhance functionality & increase cost effectiveness
    June 2012
Microtech Conference & Expo 2011 
Quality of Life and Medical Applications - MIG Special Symposia
  • Quality of Life Enabled by MEMS
    Author: Karen Lightman
    MicrotechConference and Expo MIG Special Symposia
    June 2011
  • BioMEMS Technology for Artificial Organs
    Author: Jeffrey T. Borenstein
    Draper Laboratory Microtech2011 Conference Boston, MA
    June 2011
  • Mobile Phones as Quality-­-of-­-Life Sensors
    Author: Anmol Madan
    Anmol is a recent Ph.D. from the MIT Media Lab where he modeled large-scale human behavior data using statistical and pattern recognition methods.
    June 2011
  • Total Artificial Heart Utilizes MEMS Technology
    Author: Donna Sandfox
    Omron Electronic Components
    June 2011
  • NanoMedical Systems - MIG Quality of Life Symposium
    Author: Randy Goodall
    Modern medicine provides an arsenal of sophisticated molecules to treat the inevitable health conditions that lower QoL. NMS is using nanotechnology to provide a solution to the drug delivery challenge
    June 2011
  • SVTC Technologies - 2011 Life Science Presentation
    Author: Richard Brossart
    SVTC Solutions for Life Sciences, Enabling MEMS & Microfluidics
    June 2011
  • Biomedical Engineering at Draper Laboratory
    Author: Jeffrey T. Borenstein
    MEMS-Based Therapeutic Devices
    June 2011
  • MEMS in QoL Medical Devices - Closing Keynote
    Author: Brian Wirth
    General Electric, MEMS Healthcare
    June 2011
  • Protecting & Enhancing Human Life: MEMSCAP Production for Medical/Biomedical
    Author: Steve Wilcenski
    MEMS in QoL Medical Devices and why the world is ready for Silicon-implantable Devices - MIG Special Symposia
    June 2011
  • Quality of Life Through Intelligent Monitoring
    Author: Mark DiPerri
    Freescale - Quality of Life
    June 2011
  • Medical Implants, MEMS and Quality of Life: Lessons from Cardiovascular Devices: Stents, VADs & the Total Artifical Heart
    Author: Marvin J. Slepian, M.D.
    Marvin J. Slepian, M.D., Co-Founder, Chairman, Chief Scientific and Medical Officer SynCardia Systems, Inc.
    June 2011
  • MEMS Technology in Healthcare - The Only Limit is Imagination
    Author: Tom O'Dwyer
    Analog Devices Inc.
    June 2011
  • MEMS Integration approaches Combining Micro and Nano Technologies
    Author: A. Rouzaud, Ph. Robert, J.P. Polizzi, F. Perruchot, J.L. Pornin, N. Sillon
    Léti presentation at Microtech 2011, Microsystem miniaturization and Low cost packaging for MEMS
    June 2011
MIG Conference Materials 
Programs, Overviews and attendee information from past MIG events.
  • MEMS Executive Congress 2011 Program
    Conference program from MEMS Executive Congress 2011
    November 2011
  • MEMS Executive Congress 2011 Attendee List (by company type)
    Attendee list by company name.
    November 2011
  • MEMS Executive Congress 11: Opening Comments
    Author: Karen Lightman, MEMS Industry Group
    Opening comments of MEMS Executive Congress 2011.m
    November 2011
  • MEMS Executive Congress 2011 Attendee List (by attendee name)
    Attendee list sorted by attendee names.
    November 2011
  • MEMS Executive Congress 11: Closing Thoughts
    Author: Karen Lightman, MEMS Industry Group
    Closing thoughts and conclusion of MEMS Executive Congress 2011.
    November 2011
  • M2M Forum 2011 Attendee List
    Author: MEMS Industry Group
    List of attendees from M2M Forum 2011, MIG's annual members' meeting.
    March 2011
  • MEMS Executive Congress 07: Attendees
    Author: MEMS Industry Group
    Attendees from MEMS Executive Congress 2007.
    November 2007
  • MEMS Executive Congress 07: Demographics
    Author: MEMS Industry Group
    Attendee demographics from MEMS Executive Congress 2007.
    November 2007
  • MEMS Executive Congress 08: Attendee List
    Author: MEMS Industry Group
    Attendee list from MEMS Executive Congress 2008
    November 2008
  • MEMS Executive Congress 08: Demographics
    Author: MEMS Industry Group
    Attendee demographics from MEMS Executive Congress 2008.
    November 2008
  • MEMS Executive Congress 09: Attendee List
    Author: MEMS Industry Group
    Attendee list from MEMS Executive Congress 2009.
    November 2009
  • MEMS Executive Congress 09: Closing Thoughts
    Author: MEMS Industry Group
    Closing thought from MEMS Executive Congress 2009.
    November 2009
  • MEMS Executive Congress 09: Demographics
    Author: MEMS Industry Group
    Attendee demographics from MEMS Executive Congress 2009.
    November 2009
  • MEMS Executive Congress 09: Keynote and Panel Notes
    Author: MEMS Industry Group
    A wrap-up of the discussions from MEMS Executive Congress 2009.
    November 2009
  • MEMS Executive Congress 09: Program
    Author: MEMS Industry Group
    Conference program distributed to attendees of MEMS Executive Congress 2009.
    November 2009
  • MEMS Executive Congress 10: Attendee List
    Author: MEMS Industry Group
    Attendee list from MEMS Executive Congress
    November 2010
  • MEMS Executive Congress 10: Closing Presentation
    Author: MEMS Industry Group
    A wrap-up of the discussions from MEMS Executive Congress 2010.
    November 2010
  • MEMS Executive Congress 10: Opening Presentation
    Author: MEMS Industry Group
    MIG's opening presentation from MEMS Executive Congress 2010.
    November 2010
  • MEMS Testing Standards Workshop Attendee List – March 16, 2011
    Author: MEMS Industry Group
    Attendee list of those who attendee the MIG/NIST Testing Standards Workshop.
    March 2011
  • METRIC 04: Workbook
    Author: MEMS Industry Group
    Workbook from METRIC 2004.
    September 2004
  • METRIC 05: Workbook
    Author: MEMS Industry Group
    Workbook from METRIC 2005.
    September 2005
  • METRIC 09: Workbook Opening Comments
    Author: MEMS Industry Group
    Opening section of the METRIC 2009 workbook.
    March 2009
  • METRIC 09: Working Group Descriptions
    Author: MEMS Industry Group
    Description of METRIC 2009 Working Groups
    March 2009
  • METRIC 10: Attendees
    Author: MEMS Industry Group
    Attendee list from METRIC 2010: Focus on Optimizing MEMS Fabrication
    May 2010
  • METRIC 10: Beginning Pages of METRIC Workbook
    Author: MEMS Industry Group
    Table of Contents, agenda, welcome letter, METRIC 2010 steering committee.
    May 2010
  • METRIC 10: Workbook
    Author: MEMS Industry Group
    Workbook from METRIC 2010: Focus on Optimizing MEMS Fabrication
    May 2010
  • METRIC 2009: Workbook
    Author: MEMS Industry Group
    Workbook distributed to attendees of METRIC 2009: Growth Opportunities for MEMS in a Changing Economy.
    March 2009
Sensors Expo & ESC Chicago 2011 
Presentations from Sensors Expo & Conference 2011 and ESC Chicago.
  • ACUTRONIC - Inertial MEMS Testing
    Author: Sascha Revel
    From Pre-Conference Symposia: MEMS Commercialization Opportunities for Systems and Products
    June 2011
  • Integrating MEMS with DSP & Microprocessors
    Author: Karen Lightman, others
    Main presentation from MIG and other participating companies on panel at ESC Chicago 2011.
    June 2011
  • MEMS Products: No Easy Answers
    Author: Sarah Boisvert
    Sarah Boisvert Co-founder, Potomac Photonics, Inc.
    June 2011
  • MEMS in theMainstream
    Author: Karen Lightman
    Sensors Expo Chicago Pre-conference Symposium, MEMS Industry overview
    June 2011
  • Adapting Infrastructure to a Fabless and Fablite World
    Author: Karen Lightman
    Introduction to panel at Sensors Expo 2011.
    June 2011
  • Movea - Adapting Infrastructure to a Fabless and Fablite World Panel
    Author: Bruno Flament
    Movea's presentation from the Adapting Infrastructure to a Fabless and Fablite World Panel at Sensors Expo 2011.
    June 2011
  • Analog Devices - Adapting Infrastructure to a Fabless and Fablite World
    Author: Rob O'Reilly
    Analog Devices' presentation from the Adapting Infrastructure to a Fabless and Fablite World Panel at Sensors Expo 2011.
    June 2011
  • New Business Models in the MEMS Industry
    Author: Laurent Robin
    Yole Développement's presentation from Sensors Expo 2011.
    June 2011
  • From Prototype to Volume Production: A Roadmap for Success
    Author: Magnus Rimskog
    Silex Microsystems' presentation from Sensors Expo 2011.
    June 2011
Webinars 
MEMS Education Series webinars
  • MEMS Enabling Mobile Healthcare Innovation
    The healthcare market is slow to adopt new technologies due to strict regulations they must follow for patient safety and privacy. This is why, while most other markets have embraced new technology, the healthcare market is still relying on fax machines and handwritten notes. But we are reaching the point where the current health system is unsustainable because there are too many people who are elderly or ill, combined with astronomical healthcare costs, and rapidly improving technological capabilities that are driving consumers to demand better care. The future of healthcare is being manufactured by the consumer’s demand for big data. And big data is made possible in part by MEMS. This webinar will address how MEMS and the changing healthcare culture have come together to create a perfect environment for innovation within the consumer segment. Presented by: Michell Prunty, Senior Consumer Analyst for Semico Corporation Hosted by: Karen Lightman, Managing Director, MEMS Industry Group
  • Where is the love for MEMS?
    Author: Karen Lightman, managing director, MEMS Industry Group
    November 2012
  • 2012 Status of the MEMS Industry
    Author: Yole Développement
    October 2012
  • A Global Analysis of the Current MEMS Market
    Author: Jeremie Bouchaud, iSuppli
    A Global Analysis of the Current MEMS Market. For audio playback, please visit this website: https://www3.gotomeeting.com/register/451172846
    July 2011
  • Critical Success Factors for the Commercialization of MEMS: The 2012 MEMS Industry Report Card
    Author: Roger Grace, Roger Grace Associates
    Barriers to the commercialization of every industry and technology exist, and MEMS is no exception. This presentation presents a "MEMS Industry Report Card for 2012", which addresses 14 critical success factors/barriers for the commercialization of MEMS and the progress made to date to overcome these barriers. Some of the topics addressed are: R&D, Marketing, Infrastructure Development, Management Expertise, Creation of Wealth and Profitability. This report card has been updated and presented annually since 1998 and continues to be presented yearly to enthusiastic audiences worldwide. Come join the latest of these critical discussions.
    April 2013
  • Ensuring Successful Delivery of MEMS Products from a MEMS Foundry
    Author: MEMS Industry Group
    Now that you’ve learned about navigating the foundry relationship, we’ll explore some of the remaining issues to ensure the successful delivery of your products from the MEMS foundry. You will have the opportunity to ask our experts anything related to MEMS foundry if you missed either of the first two webinars. Topics explored include the fabless business model, second source foundries, supply chain issues, and integration factors. Webinar replay is available at www.memseducationseries.com
    May 2011
  • How the International Trade Administration Can Help MEMS Industry Group Members Increase Exports
    Author: Matthew A. Hein, International Trade Specialist, U.S. Department of Commerce, Deana M. Shick, International Trade Specialist, United States Commercial Service
    With 95 percent of the world's population located outside the United States, there are myriad opportunities for U.S. companies to export products and services to these potential customers. Join this webinar to find out how the International Trade Administration (ITA--part of the U.S. Commerce Department) can help your firm locate and leverage export opportunities, using the resources of ITA headquarters, more than 100 field offices across the U.S. and more than 70 offices worldwide
    January 2013
  • How to Turn Your Technology Company into a Market-Driven Profit Machine
    Author: Sarah Boisvert
    Marketing Guru Sarah Boisvert, Co-founder of Potomac Photonics, Inc., will demonstrate how customer and market driven companies out-perform technology driven businesses in revenue generation, profitability and shareholder value. Through case studies and personal experience, Sarah will capture your innovative imagination and drive it to new directions. Practical guidelines on how to turn YOUR company into a market-driven profit machine will be included.
    May 2011
  • Improving Performance of MEMS Designs Using Optical Characterization
    Author: Polytec
    Polytec presented several characterization studies that have successfully applied Micro System Analyzer (MSA) technology using optical characterization of MEMS. Currently, this technology is widely used in the MEMS research community.
    September 2011
  • Inertial Micropump Technology for Microfluidic Applications
    Author: Alexander Govyadinov, HP
    There are many new and exciting opportunities for the MEMS industry in the field of microfluidics.  This informative webinar focuses on the potential for low-cost, high efficiency, bubble driven inertial micro-fluidic pumps being developed at HP. Alexander Govyadinov, Lead Technologist of the HP - Printing and Technology Development organization, educates attendees on the advancements that his organization has made and will discuss the potential applications of a small form-factor and easy to integrate microfluidic micropump for Lab-on-Chip applications. 

    March 2013
  • Innovations in RF MEMS: from the University to Industry
    Author: Professor Mina Rais-Zadeh, Group Leader, “High Frequency MEMS” Thrust at the Center on Wireless Integrated MicroSensing and Systems (WIMS2) at the University of Michigan
    Professor Rais-Zadeh will present her current research in High Frequency MEMS at the Wireless Integrated MicroSensing and Systems Research Center (WIMS2) at the University of Michigan. Focusing on advanced RF devices and microsystems, she’ll discuss the potential industry applications for RF MEMS in timing and navigation units, reconfigurable radios, medical and subsurface imaging, night vision, and infrared sensing. Also, the design and characterization of some high-performance reconfigurable RF modules, including acoustic filters, resonators and resonant sensors and the challenges with implementing tunable RF components will be discussed. Grab a coffee, bring your questions and join us for this informative talk.
    January 2013
  • M2M Forum Webinar: Market Pull Vs. Technology Push
    Author: Jim Knutti, Acuity Incorporated, Mike Mignardi, Texas Instruments, MEMS Industry Group
    Using case studies and examples from a MEMS-specific point-of-view, this webinar examined customer interface factors that may determine the development time from concept to production of MEMS enabled systems.
    April 2012
  • MEMS Executive Congress 2011 Preview
    Author: MEMS Industry Group
    A preview of what's in store for MEMS Executive Congress 2011.
    August 2011
  • MEMS Executive Congress Europe 12: Preview Webinar
    Author: MEMS Industry Group
    Learn what to expect at the very first European installment of MEMS Executive Congress, March 20, 2012.
    February 2012
  • MEMS Executive Congress US 2012 Preview
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    Get an inside look at what's planned for MEMS Executive Congress US 2012.
    October 2012
  • MEMS Reliability: A Case Study
    Author: Mehran Mehregany
    Diversity of MEMS devices and their broad range of applications has been dictating the need for unique and customized modeling, test and reliability analysis for each device in its respective application. In this presentation, an accelerometer is selected for a case study. Various tests, both quantitative and qualitative, will be described and different failure modes and mechanisms are reviewed.
    March 2012
  • New Prototyping Technologies Speed MEMS Commercialization
    Author: Sarah Boisvert, POtomac Photonics
    Sarah Boisvert shares her knowledge through case studies and personal experiences about helping your company reduce the time to market of your MEMS products.
    August 2011
  • Micro- and nano-electromechanical switches: A detailed look into these promising technologies
    Author: Maarten De Boer, Mechanical Engineering Professor, Carnegie Mellon University
    June 2013
  • Sensor Fusion: The Elements are Converging
    Author: Semico Research
    Webinar presented by MIG partner Semico Research.
    March 2013
  • Webinar: Concurrent Design to Achieve High Performance and Low Cost: Case Study of a MEMS Automotive Pressure Sensor Design
    Author: David DiPaola, Managing Director, DiPaola Consulting
    David DiPaola of DiPaola consulting will illustrate the importance of concurrent design in achieving high performance, yet low cost MEMS integration. Through a case study focused on automotive pressure sensor design, he’ll demonstrate how to overcome challenging customer-driven requirements.
    December 2011
  • Webinar: Consumer & Mobile: MEMS El Dorado?
    Author: Jérémie Bouchaud , Director & Senior Principal Analyst, MEMS & Sensors - IHS iSuppli
    The expansion of MEMS sensors in consumer markets continues unchecked. The market for MEMS sensors in this sector grew 15% in revenue last year to reach $2.9 billion, and in 2013, should grow by another 18%. By 2016, the market will have almost doubled to $5.6 billion, despite aggressive price erosion.

    Sensors other than MEMS are also gaining traction in mobile applications. Light sensors are already standard issue in smartphones in the form of ambient light and proximity sensors, RGB color sensors recently joined the fray. Humidity sensors had a breakthrough when this type of sensor was adopted by the Samsung Galaxy S4 mobile phone. UV, gas and other environmental/health sensors will also be coming to a cell phone near you soon.

    In this webinar, IHS will present its latest findings on the most exciting MEMS and sensors areas, the increasing focus on combo sensors, regional trends, emerging and new applications and opportunities for newcomers.


    May 2013
  • Webinar: Healthcare is Brimming with Opportunities for MEMS
    Author: Mehran Mehregany, Ph.D.
    Ubiquitous connectivity and computing are bringing about unprecedented mobility—allowing working,entertainment, shopping, socializing, gaming, etc., anytime, anywhere. This trend is also infiltrating health care, promising significant improvements in quality, convenience, reach and cost of care through “wireless health” solutions. Wireless health solutions enable diagnosis, therapy and monitoring of health-related conditions by tracking relevant biomarkers, managing treatment regimen and monitoring progress—while the patient goes about her daily life. At the same time, microsystems are increasingly enabling nonintrusive measurement of health and disease conditions, as well as delivery of therapy on demand. Social networks are promoting peer comparisons and competitions in health and wellness, motivating behavioral change and providing a community of support. Meanwhile, advances in genomics are ushering in the new era of personalized medicine. The convergence of these trends will result in individualized, preventative medicine that is time and place independent. This webinar provides an overview of wireless health (also known as mHealth and digital health) and the related potential for microsystems.
    September 2012
  • Webinar: Improving Performance of New MEMS Designs: An Insider’s Look at imec’s SiGe above-IC MEMS Technology Platform
    Author: Simone Severi, imec
    Imec has developed a CMOS compatible set of modules for providing additional functionality of basic MEMS devices using a SiGe thin film wafer level packaging platform. On this webinar, Simone Severi, Team Leader of the MEMS integration group at imec will give an overview of SiGe MEMS technology using an IC standard fabrication toolset for monolithic integration on CMOS. He’ll give examples of the product development cycle of successful devices manufactured at imec to demonstrate the advantages of the technology and educate participants on the special considerations required for test, reliability, and reducing cost.
    January 2012
  • Webinar: Innovative MEMS Packaging for Future Technologies
    Author: Andrew “Andy” Oliver Ph.D., Industrial Liaison and Principal Staff Scientist, Wireless Integrated MicroSensing and Systems Research Center (WIMS2)
    This webinar concentrates on three innovative research topics that may help your company improve its MEMS packaging. Developed by the Center for Wireless Integrated MicroSensing and Systems at the University of Michigan, these new packaging technologies focus on: Wafer bonding including field assisted gold silicon eutectic, solder based bonding, and parylene based wafer bonding. Thin film packaging/sealing thin film electroplated metal packages (for both vacuum packaging and biomedical packaging applications.) Mechanical and thermal isolation packages for inertial sensors.
    June 2012
  • Webinar: M2M Forum Recap: What's Next for MEMS New Product Development?
    Author: MEMS Industry Group
    This webinar highlights the discussions from M2M Forum and how the ideas exchanged at this neutral forum for discussion may help your company improve its process for developing new products. Find out what’s next for MIG and the MEMS industry during this webinar by listening to the replay.
    May 2012
  • Webinar: MEMS and Nano in Diagnostics: Clinical and Investment Perspectives
    Author: Mostafa Analoui, Ph.D., Livingston Securities
    Diversity of MEMS devices and their broad range of applications has been dictating the need for unique and customized modeling, test and reliability analysis for each device in its respective application. In this presentation, an accelerometer is selected for a case study. Various tests, both quantitative and qualitative, will be described and different failure modes and mechanisms are reviewed.
    April 2012
  • Webinar: MEMS Packaging: Transforming the Challenges into Solutions
    Author: iNemi
    Join Bill Bottoms, Packaging TWG (Technical Working Group) Chair for iNEMI (International Electronics Manufacturing Initiative) and Charles Richardson, Director of Roadmapping for iNEMI in this informative webinar to discuss the MEMS packaging challenges uncovered in their recent road mapping exercise. Now in preparation for their 2013 Roadmap, with the help of the MEMS industry, iNEMI will identify the next steps to address key areas in packaging including MEMS in SiP, relays, pressure sensors, accelerometers and microfluidics.
    August 2012
  • Webinar: MEMS: Looking for the Next Killer App
    Author: Presented by: Jérémie Bouchaud, Director and Principal Analyst, MEMS & Sensors, IHS iSuppli
    MEMS market overview and discussion of what the next "killer app" could be in the industry.
    July 2012
  • Webinar: Overview of the Current State of MEMS Reliability and Test
    Author: Mehran Mehregany
    Topics included in this webinar included an introduction to MEMS devices, the definition of reliability as it relates to MEMS, and the current state of reliability. Failure modes for each device type were discussed.
    September 2011
  • Webinar: Technology Platform for Various MEMS Scanner Products: An Approach to Overcoming MEMS Law
    Author: Fraunhofer IPMS with Coventor
    Due to a large variety of MEMS devices we find a wide spectrum of MEMS technologies. Usually for each MEMS device, specific manufacturing and packaging processes are necessary. Unlike CMOS, MEMS has no standard process and the development of a process standardization is not possible or more complicated compared to the CMOS world. This situation is described in the “MEMS Law”: "One MEMS, one process”. This results in a couple of disadvantages for the industrial fabrication of MEMS. Most critical issues are the long time to market, high development cost for each MEMS device and high hurdles for fabless MEMS companies to find the adequate provider of MEMS technologies.
    October 2011
  • Prospects for MEMS and Sensors in the Automotive Sector
    Author: Richard Dixon, Principal Analyst MEMS & Sensors, IHS Electronics & Media
    The MEMS and automotive sensor market is expected to grow from $2.9 billion in 2012 to over $4 billion in 2017, a CAGR of around 7%. In the near-term, IHS iSuppli anticipates sales rates well above this figure, ultimately driven by mandates and emissions regulations relating to safety applications and powertrain in mature markets on the one hand, and emerging economies requiring initially basic sensor enabled functionalities on the other.
     
    In the powertrain domain, emission regulations also keep manufacturers on their toes. In Europe, the advent of Euro VI standard in 2015 will impact both gasoline engines and the popular diesel market. Meanwhile, the electric vehicle poses the biggest threat to powertrain sensors—it will eliminate some but add new devices that manage the electric motors. Hybrid variants with combinations of combustion engine and electric powertrain will exist requiring more or less sensors in the internal combustion engine, underlying the fact that sensors will remain a key electronic component of today’s and tomorrow’s vehicles.

    July 2013
  • Webinar: Standardizing the Internet of (Important) Things
    Author: Dr. Xavier Vilajosana, UC Berkeley Sensor and Actuator Center & Dr. Thomas Watteyne, Linear Technology/Dust Networks
    June 2013
  • Innovative Manufacturing Solutions for MEMS and Magnetic Sensors
    Author: Jeremie Bouchaud, IHS; Katrina Rook, Ph.D, Veeco; Frank Cerio, Ph.D, Veeco
    We discuss manufacturing solutions for next generation MEMS and Magnetic Sensors, such as patterning of advanced piezoelectric devices and high rate deposition of magnetic materials. 
     
    The surging demand for low cost sensors requires fabrication methods that are proven high volume manufacturing techniques.  This webinar, focuses on manufacturing innovations required for unique materials:
     
    -New deposition techniques that enable the deposition of soft magnetic materials such as Permalloy, for a variety of magnetoresistive MEMS applications
     
    -The ability to sputter at high rates while maintaining magnetic alignment
     
    -Ion beam etch for patterning of advanced piezoelectric devices while maintaining critical dimensions
     
    This webinar discusses these and other inflections in the market and the prospects for automotive sensors in future.
  • Leading Techniques for the Nano-scale Etching and Deep Etching of Silicon
    Author: Michelle Bourke, Business Group Director, Oxford Instruments Plasma Technology
  • Integrating Information Security in your Development Lifecycle for Medical Devices
    Author: Lee Kim, BS, JD, HIMSS Director, Privacy & Security
    January 2014
  • Maximizing Your PR Program through MIG
    Author: Maria Vetrano

    Opportunities for MIG member-companies, presented by Maria Vetrano, Vetrano Communications


    April 2014
Recordings 
Audio recordings from presentations.
  • CES 2012 Panel Recording: "Connecting the Real World with the Digital World: Harnessing the Power of MEMS"
    Author: Moderated by Karen Lightman, MEMS Industry Group. Panelists from WiSpry, Freescale Semiconductor, Bosch Sensortec, VTI Technologies
    Panel Description: We are living in a digital world where the mobile device rules supreme. Consumers cannot seem to get enough features on mobile handsets, tablet PCs or e-readers. People of all ages are using console video games that interpret motion more realistically than ever. Navigational technologies don’t just keep us oriented in our cars; embedded into mobile handsets, they give us location awareness on the street as well. We are controlling and interacting with our portable devices in exciting new ways. And the newest growth drivers on the block—MEMS — are truly driving the adoption of new consumer applications and products. MEMS devices — tiny micro-electromechanical systems that provide intelligent sensing and actuation — let us interact with the digital world in ways we could only imagine in years past. Discover MEMS’s amazing capabilities and fire questions about motion sensing, user-interface control and multiband mobile-phone design with our panel of MEMS industry executives.
    January 2012
Smart Systems Integration 2012 
March 21-22, 2012 in Zurich, Switzerland.
  • Market Trends and Recent Advances in Inertial Sensors Technology for Industrial and Automotive Applications
    Author: Stefan Hartmann, Epson Europe Electronics GmbH
    •Seiko Epson Corporation –Sensors •Inertial Sensor Market & Drivers •Gyro Sensor Classification •QMEMS-based Double-T-Element •Gyro-Sensor Implementation •Inertial Measurement Units –Key Characteristics & Performance Impacts
    March 2012
  • MEMS in the Mainstream: Introduction to MEMS Industry Group & US MEMS Industry
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    Overview of MEMS Industry Group and the US MEMS industry
    March 2012
  • Sensor Integration and Sensor Fusion in Mobile Product Designs
    Author: Ed Brachocki, Kionix
    Kionix presentation at Smart Systems Integration 2012.
    March 2012
  • Overview of Smart and Intelligent Sensors
    Author: Stephane Gervais-Ducouret, Freescale
    Smart Systems Integration 2012
    March 2012
  • A Practical Method for Predicting Fracture Risk of MEMS
    Author: Alissa M. Fitzgerald, Ph.D., AM Fitzgerald & Associates
    •The problem of MEMS mechanical reliability •Fracture prediction method: combines process-specific data with finite element analysis •Verification data
    March 2012
  • Karen Lightman, Managing Director MEMS Industry Group www.memsindustrygroup.org 21. March 2012 All photos copyrighted and used with permission. MEMS Sensor Fusion and Integration Challenges and Opportunities
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    March 2012
Smart Systems Integration 2013 
March 2013, Amsterdam, The Netherlands. Presentations from the MIG-organized US MEMS Session.
  • MEMS Sensor Fusion: Faster. Stronger. Smarter
    Author: MEMS Industry Group
    Presented by Karen Lightman at Smart Systems Integration 2013, this presentation gives a global MEMS market overview, a US MEMS market overview, an overview of MEMS sensor fusion and the challenges and opportunities associated with it.
    March 2013
  • Movea: Bring Your Products to Life
    Author: Dave Rothenburg, Movea
    Presented at Smart Systems Integration 2013, this presentation discusses sensor fusion and data fusion.
    March 2013
  • MicroGen Systems: Piezo-MEMS vibration energy harvesters and systems modules
    Author: Robert Andosca, MicroGen Systems
    Presented as part of the US MEMS session at Smart Systems Integration 2013, this presentation gives an overview of the technology developed at MicroGen Systems and wireless sensor networks and market environments.
    March 2013
  • Sensor Fusion for Architecting the Future of MEMS
    Author: Charles W.K. Gritton, Ph.D., Hillcrest Labs
    Presented at Smart Systems Integration 2013 during the US MEMS Session, this presentation describes some of the un-sexy sensor fusion aspects that have a big impact on overall performance.
    March 2013
  • General Electric Smart Systems Integration
    Author: Brian Wirth, Global Sales Director, Healthcare Sensing
    Presented as a keynote address at Smart Systems Integration 2013, this presentation discusses the need for smart healthcare systems.
    March 2013
MEMS Executive Congress Europe 2012 
  • MEMS Executive Congress Europe 2012 Program
    March 2012
  • Welcome and Overview
    Author: Karen Lightman, MEMS Industry Group
    March 2012
  • Introduction to EV Group
    Author: Steven Dwyer, EV Group
    March 2012
  • Introduction to SPTS
    Author: Dave Thomas, Ph.D., SPTS Technologies
    March 2012
  • MEMS are Limited Only by Imagination
    Author: Carmelo Papa, STMicroelectronics
    March 2012
  • The MEMS-Enabled Automobile – An Inside Look at Audi's Vorsprung durch Technik
    Author: Markus Buhlmann, Audi AG
    March 2012
  • Introduction to ACUTRONIC
    Author: Maurus Tschirky, ACUTRONIC
    March 2012
  • Mainstream MEMS: Enabling life-changing innovation
    Author: Michel Rosa, Ph.D., Applied Materials
    March 2012
  • MEMS in Consumer Products
    Author: Kai Seikku, Okmetic
    March 2012
  • Closing Thoughts
    Author: Karen Lightman, MEMS Industry Group
    March 2012
M2M Forum 2012: Focus on MEMS New Product Development 
Conference materials from our annual members' meeting, held May 8-10 in Pittsburgh, Pennsylvania.
  • ACUTRONIC USA Site Visit Presentation
    Author: ACUTRONIC
    Presentation given at the ACUTRONIC breakfast and site visit after M2M Forum 2012.
    May 2012
  • BARRIERS TO THE SUCCESSFUL COMMERCIALIZATION OF MEMS: THE 2011 MEMS INDUSTRY REPORT CARD
    Author: Roger H. Grace President, Roger Grace Associates
    May 2012
  • Benefits to Working with a University Research Lab in the Post Recession Era
    Author: Andrew “Andy” Oliver, Ph.D." Industrial Liaison and Principal Staff Scientist" WIMS2 Research Center" the University of Michigan
    How Universities and Industry can Partner for Success
    May 2012
  • Bridging the Chasm from Idea to Production for Emerging Technologies
    Author: Prakash Krishnan, SVTC Technologies
    July 2011
  • Conference Workbook - M2M Forum 2012
    Author: MEMS Industry Group
    conference workbook, containing research and market data
    May 2012
  • ENABLING HIGH TEMPERATURE MEMS WITH STANDARDIZED PACKAGING PLATFORMS
    Author: Matt Apanius SMART Center Lorain County Community College Elyria, OH, Mike Ward Linear Dimensions Cupertino, CA, John O’Boyle Maxim Integrated Products Sunnyvale, CA
    The semiconductor market grew to approximately $300 billion in 2011 with the MEMS component market growing to about $10 billion. The acceleration of the consumer MEMS market resulted in billions of units per year for total market including MEMS products such as acceleration sensors, gyros, magnetic sensors, microphones, pressure sensors, and RF filters. Yole Développement, and iSupply have forecasted this growth path to reach $20 billion in 2016 (Bryzek 2012). High temperature applications such as turbine engine control, down-hole drilling, energy conversion, and automotive electronics can benefit from this unprecedented upward trend, yet due to the technical challenges imposed by high temperature applications, commercial products are not yet experiencing the growth seen in consumer electronics. Some companies have tried methods like up-screening with no real success. What is needed is an added value high-temperature remedy for an effective, high reliability solution (O’Boyle). Numerous MEMS devices for high temperature applications have been developed over the last few decades, though existing wired and wireless controllers for high temperature sensing are not able to take advantage of the efficiencies offered by MEMS solutions because of the lack of counterpart high temperature integrated circuits (IC).
    May 2012
  • Improving Performance of New MEMS Designs: An Insider’s Look at imec’s SiGe above-IC MEMS Technology Platform
    Author: Simone Severi, imec
    Imec has developed a CMOS compatible set of modules for providing additional functionality of basic MEMS devices using a SiGe thin film wafer level packaging platform. On this webinar, Simone Severi, Team Leader of the MEMS integration group at imec will give an overview of SiGe MEMS technology using an IC standard fabrication toolset for monolithic integration on CMOS. He’ll give examples of the product development cycle of successful devices manufactured at imec to demonstrate the advantages of the technology and educate participants on the special considerations required for test, reliability, and reducing cost.
    January 2012
  • iNEMI Roadmap MEMS section
    Author: iNEMI
    May 2012
  • MEMS NEW PRODUCT DEVELOPMENT SURVEY AND INTERVIEW ANALYSIS
    Author: MEMS Industry Group, contributors
    The main goal of M2M Forum is to provide its members new and valuable information to help determine and guide collaborative projects and initiatives that help move the MEMS industry forward. In March 2012, MEMS Industry Group (MIG) conducted an industry wide survey and series of interviews with MEMS companies to tap into the knowledge of industry leaders to use as a resource before, during, and after M2M Forum. The research was focused on understanding the challenges in MEMS commercialization and the relationship between market pull and technology push. The questions were developed in conjunction with the M2M Forum steering committee members, with special help of the M2M Forum working group moderators. Analysis and conclusions from the survey and interviews are below.
    May 2012
  • MEMS SUPPLY CHAIN INTERVIEWS
    Author: MEMS Industry Group, contributors
    May 2012
  • Roadmap to a $Trillion MEMS Market
    Author: Dr. Janusz Bryzek, VP MEMS Development, Fairchild Semiconductor, Mancef, Board Member
    Transistor and MEMS technologies originated from the pioneering Bell Labs work in the late 1940s and early 1950s. While the resulting semiconductor market grew to approximately $300B by 2011, the MEMS component market experienced much slower growth to an estimated $10 billion in 2011. Recent dramatic acceleration of the consumer MEMS market growth resulted from Steve Jobs’ conversion of a cell phone into a powerful computer. Computing power enabled the creative user interfaces, such as touch sensitive screens and auto landscape-portrait rotation, opening a Tornado for MEMS adoption. Acceleration sensors, gyros, magnetic sensors, microphones, pressure sensors and RF filters grew by 2011 to a multibillion units/year total market.
    May 2012
  • Schematic Presentation of Technology Push and Market Pull
    May 2012
  • Sensors System Integration Challenges
    Author: Len Sheynblat, Qualcomm
    May 2012
Sensors Expo 2012 
Pre-Conference Symposium: MEMS in the Mainstream: Commercialization and Product Realization - Leveraging the MEMS Infrastructure
  • Fraunhofer ENAS Generations of smart integrated systems – overview and novel examples
    Author: Prof. Dr. Thomas Gessner, Fraunhofer Institute for Electronic Nano Systems ENAS
    -Power for smart integrated systems -Communication -Silicon based MEMS/NEMS – Gyroscopes -CNT based sensors -Lab on a chip
    June 2012
  • Leveraging MEMS infrastructure to serve diverse market segments
    Author: Jim Knutti, Acuity, Inc.
    Overview of MEMS Evolution
    June 2012
  • Leveraging MEMS to work in everyday life
    Author: Tim Worst, Chief Technologist and General Manager, Pressure Sensor Limited
    Overview of Pressure Sensor Limited
    June 2012
  • MEMS in the Mainstream: Commercialization and Product Realization , Leveraging the MEMS Infrastructure
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    -Overview of MEMS Industry Group (MIG) -Upcoming MIG Events and Programs -MEMS in the Mainstream -Commercialization and Product Realization - Leveraging the MEMS Infrastructure
    June 2012
  • Navigating a Complex Sensor World
    Author: John Chong, Ph.D., Director of Product Engineering, Kionix, Inc.
    June 2012
  • Overview: Innovative Micro Technology (IMT)
    Author: Craig Trautman, IMT
    Overview of Innovative Micro Technology (IMT)
    June 2012
  • MEMS Market Update
    Author: Jeff Perkins, Yole Développement
    "Making Even More Stuff," review of MEMS market
    June 2012
  • Integration & Applications of Ultra-Low Power & Compact QMEMS Sensors
    Author: David B. Gaber, Product Marketing & Business Development Manager, Inertial Sensing Products, Epson Electronics America, Inc.
    Overview of The Market Demands Tomorrow’s Technology Today
    June 2012
  • The 5 Ws of Fabless MEMS Fabrication
    Author: Carolyn D. White, Ph.D., AM Fitzgerald & Associates
    Why MEMS? What are the challenges? Where can MEMS go from here?
    June 2012
  • Pioneering a Fabless and Fablite World
    Author: Rob O’Reilly, Senior Technical Staff, MEMS Sensors and Technology Group, Analog Devices, Inc.
    June 2012
  • Overview: Silex Microsystems
    Author: Peter Himes, Silex Microsystems
    Overview of Silex Microsystems
    June 2012
  • Sensors & Location
    Author: James Clardy, Dell
    Overview of Dell sensors and sensor fusion
    June 2012
  • Sensors Expo MEMS Pre-Conference Panel Discussion: Product Realization and the MEMS Supply Chain
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    Overview of panel agenda and panelists.
    June 2012
  • Overview of Freescale Embedded Processing Solutions
    Author: Jeannette Wilson, Product Line Manager, Sensor and Actuator Solution Division (SASD) / AISG, Freescale Semiconductor
    Overview of Freescale
    June 2012
  • Intel & MEMS Overview
    Author: Stephen Whalley Director, Sensors Intel Architecture Group, Intel
    June 2012
  • Low Cost, High Volume, Integrated MotionTrackers
    Author: Steve Lloyd, VP of Engineering, InvenSense, Inc.
    From MEMS Conference track at Sensors Expo 2012.
    June 2012
  • Realization and Commercialization of MEMS Products in Recent Years
    Author: Jay Esfandyari MEMS Product Marketing Manager Analog, MEMS and Sensors Group, STMicroelectronics
    June 2012
  • Sensor Fusion: Applications, Challenges and Solutions
    Author: Stephane Gervais-Ducouret, Marketing Director, Sensors, Freescale
    June 2012
  • Co-design of Multi-sensor Micro-systems including Magnetic devices
    Author: Mary Ann Maher, PhD, SoftMEMS LLC
    June 2012
  • MEMS in High Performance Audio
    Author: Rob O'Reilly, Senior Technical Staff
    Sensors Expo 2012: MEMS Conference Track
    June 2012
MEMS Research 
Materials from partner and member organizations focused on university research and current issues in industry.
  • Wireless Integrated MicroSensing and Systems Research Center (WIMS2) Newsletter
    Author: Wireless Integrated MicroSensing and Systems Research Center
    Edition features research in the area of MEMS enabled miniature gas chromatographs and environmental sensors and guest article from Kurt Peterson on the current environment and criteria for VC and angel funding.
    July 2012
BSAC/MIG Fall 2012 Workshop 
MIG Workshop: MEMS Product Development Challenges - Sweet Dreams and Nightmares
  • Innovation in MEMS: The Case for Process Flexibility and the Foundry Model
    Author: Peter Himes, Silex Microsystems
    September 2012
  • Knowles Electronics: History and Challenges in bringing to market a MEMS microphone with a FABLESS business model
    Author: Angelo Assimakopoulos, Senior Director
    September 2012
  • To Integrate or Not to Integrate: A Case Study on Sytem-in-Package Integration for MEMS-based Products
    Author: Dave Monk, Director, Automotive Sensor Products, Freescale
    September 2012
  • MIG Workshop: MEMS Product Development Challenges - Sweet Dreams & Nightmares
    Author: Karen Lightman, Managing Director, MEMS Industry Group
    September 2012
MIG Partner Materials 
Materials from MIG industry partners
  • MIPI + MIG Member Sensor Interface Survey Results
    Author: MIPI Alliance
    MIPI Alliance partnered with MIG to poll its members interested in wireless sensors. Research objective: Determine if a sensor interface for mobile devices is needed. If so, what would be the technical requirements. The following results will guide the Sensor BoF.
    November 2012
MEMS Executive Congress US 2012 
Held November 7-9, 2012 in Scottsdale, Arizona.
  • Morning Keynote Speaker - "Ultra Low Power Electronics in the Next Decade"
    Author: Ajith Amerasekera, Director, Product Acceleration, High Performance Analog Business, Texas Instruments
    November 2012
  • Afternoon Keynote Speaker - "Ideas, not Objects"
    Author: Robert Brunner, Founder, Creative Director and Partner, Ammunition
    November 2012
  • Afternoon Keynote Speaker - Introduction
    Author: Mike Rosa, Applied Materials
    November 2012
  • BodyMedia VUE Patch
    Author: Ivo Stivoric, BodyMedia
    November 2012
  • MEMS in Consumer Products Panel - Introduction
    Author: Satwant Singh, Lattice Semiconductor, MIPI Alliance
    November 2012
  • MEMS in Emerging Technologies Panel - Introduction
    Author: Spencer Wall, OEM Group
    November 2012
  • MEMS in Medical/Quality of Life Panel - Introduction
    Author: Brian Stephenson , Tronics
    November 2012
  • MEMS Market Panel - Emerging MEMS applications: Making the world more sensitive
    Author: Jean-Christophe Eloy, Yole Développement
    November 2012
  • MEMS Market Panel - Introduction
    Author: Kevin Crofton, SPTS
    November 2012
  • MEMS Market Panel - MEMS in Mobile Handsets: Taking Advantage of Rapid Growth
    Author: Steve Ohr, Gartner, Technology and Service Provider Research
    November 2012
  • MEMS Market Panel - Sensor Fusion: The Elements are Converging
    Author: Tony Massimini, Semico Research
    November 2012
  • MEMS Market Panel - The MEMS Microphones Story
    Author: Jérémie Bouchaud, IHS iSuppli
    November 2012
  • MEMS Technology Showcase - 12-Axis Xtrinsic Sensor Platform for Windows 8
    Author: Freescale Semiconductor
    November 2012
  • MEMS Technology Showcase - Introduction
    Author: Bryan Hoadley, Movea
    November 2012
  • MEMS Technology Showcase - Light Bohrd
    Author: Light Bohrd
    November 2012
  • MEMS Technology Showcase - The Age of Algorithms
    Author: Shawn G. DuBravac, Consumer Electronics Association
    November 2012
  • MEMS Technology Showcase - The Intel® Atom™ Processor Z2760
    Author: Ken Foust, Intel Architecture Group
    November 2012
  • Morning Keynote Speaker - Introduction
    Author: Dave Kirsch, EV Group
    November 2012
  • Update on MIG
    Author: Karen Lightman, MEMS Industy Group
    November 2012
  • Welcome to MEMS Executive Congress
    Author: Karen Lightman, MEMS Industy Group
    November 2012
2013 CES - MEMS Session & Content 
January 8-11, 2013 | Las Vegas Convention Center | Las Vegas, NV
  • The MEMS Generation: Why Miniature ‘Machines’ are changing the User Experience with Everything
    Author: Klaus Meder – President of Automotive Electronics Division
    January 2013
  • MEMS keep bubbling in Consumer & Mobile
    Author: Jérémie Bouchaud, Director and Principal Analyst, MEMS & Sensors
    January 2013
  • 2013 International CES MEMS Conference Session Introduction
    Author: Karen Lightman, MEMS Industy Group
    Introduction to MEMS Overview of MEMS Consumer Electronics Market Introduction to MEMS Industry Group (MIG) Introduction of Today’s Session – Keynote and Panelists
    January 2013
MIG Technology Development Protocol (TDP) Template 
  • MIG Technology Development Process Template _whitepaper_ March 2013
    Author: MEMS Industry Group and Members

    Product development in the MEMS industry is in most cases a collaborative effort of several independent companies across the value chain. A customer can contract different companies for the development of a specific product or part of a product (then using several partners to collaboratively develop the product). This collaboration is accompanied by pitfalls arising from the distribution of tasks and knowledge as well as the interdependencies between the different product parts. In such a development setting, communication and holistic technology information management becomes a key success factor. To successfully commercialize a new product, business partnerships throughout the supply chain require well managed expectations, clear organizational alignment and a well-structured, clearly defined collaborative engineering process.

    The MEMS Industry Group® (MIG) Technology Development Process (TDP) template utilizes a StageGate® process framework for communicating expectations and facilitating a constant alignment between all involved partners. The template outlines roles & responsibilities of major groups and the associated high level requirements. For each stage it provides an example process, deliverables and gate framework for member companies to use as a guide for their engineering efforts.This whitepaper briefly describes the motivation and history of the TDP template development efforts and provides an overview of the current status, process and guidelines of the template. Furthermore the interested reader is directed to further resources providing more detail and background concerning collaborative engineering methodology.


    March 2013
  • MIG TDP Template Summary from M2M Workshop _ slides_May 2012
    This is the draft of the TDP template that was presented to attendees of M2M Forum 2012: Focus on MEMS Product Development. Please see the white paper for complete information.
    May 2012
  • Technology Development Process and Product Life Cycle: A MEMS View_ webinar_February 2012
    Author: MEMS Industry Group
    This webinar contains a sneak peak of the MEMS Product Life Cycle Template and a case study on automotive MEMS pressure sensors we've been working on as part of the research for our annual members meeting, M2M Forum: Focus on MEMS New Product Development. The MEMS Product Life Cycle Template highlights ways to make MEMS development and production more efficient in terms of development expectations, specification setting, and tollgate definitions.
    February 2012
M2M Forum® 2013: Focus on How MEMS is Shaping the Future of Medical Devices 
Content is updated as it's received
  • Bioengineering & Clinical Applications of the Circulating Tumor Cell Chip (CTC-Chip)
    Author: Mehmet Toner, Professor of Surgery, Massachusetts General Hospital, Harvard Medical School Harvard - MIT Division of Health Sciences
    May 2013
  • Closing Presentation
    Author: Karen Lightman, Executive Director, MIG
  • Commercializing MEMS-­-enabled Products: A View from the Ivory Tower
    Author: Martin Schmidt
    This presentation is not for distribution!
    May 2013
  • Excel Attendee List
    Password = mig
  • Medical Sensor and Sensing: New Materials, Medical Research and mHealth Converging Fast!
    Author: Mark Winter, Senior Director, Qualcomm Tricorder XPRIZE, Nokia Sensing X CHALLENGE, XPRIZE
    May 2013
  • MEMS Standardization
    Author: Steven Whalley, Director, Sensors, Intel Architecture Group, Intel
    May 2013
  • Microsystems for Implantable Drug Delivery
    Author: Jeffrey Borenstein, Technical Director, Biomedical Engineering Center, Charles Stark Draper Laboratory
    May 2013
  • Opening Presentation
    Author: Karen Lightman, Executive Director, MIG
  • Outlook for MEMS in Digital Health
    Author: Shane Walker, Associate Director at InMedica IHS
    May 2013
  • Overcoming Challenges of Integrating MEMS into Medical Devices – from Product Development to Manufacturing
    Author: Asmita Khanolkar, Program Manager, SMC Ltd.
    May 2013
  • Poster Session - "High-throught Neurotechnology Group"
    Author: Yanik, MIT
    May 2013
  • Poster Session - "In-Vivo Optogenetic Neural Circuit Control using 3-D Microfabricated Optical Waveguide Arrays"
    Author: Zorzos, MIT
    May 2013
  • Poster Session - "Cell Squeezing: A Vector-free Platform for Microfluidic Intracellular Delivery"
    Author: Sharei, MIT
    May 2013
  • The Role of MEMS in the Future of Health Care Delivery
    Author: Mehran Mehregany, Goodrich Professor of Engineering Innovation Director, Wireless Health Program Director, Case School of Engineering.
    May 2013
Sensors Expo 2013 - Pre Conference 
  • Thinking Outside the (Mobile) Box: Other Important High-value Applications for Sensor Fusion
    Author: Alissa Fitzgerald
    June 2013
  • Panel Discussion - A Dive into Standardization
    Author: Lightman, DiPaola, Foust, Oh, Singh
    June 2013
  • Android as a Platform for Sensor Fusion Education and Evaluation - Movie Clip
    Author: Michael Stanley
    June 2013
  • Android as a Platform for Sensor Fusion Education and Evaluation
    Author: Michael Stanley
    June 2013
  • How the Micro-Amp Magnetic Gyro Opens up New Possibilities for Mobile Applications
    Author: John Chong
    June 2013
  • Sensor Modeling for MEMS Sensor Fusion
    Author: Mary Ann Maher
    June 2013
  • Architectures for "Always-on" Motion Sensor Fusion for Mobile Devices
    Author: Per Slycke
    June 2013
  • Always-on Sensors for Context Awareness
    Author: Kevin Shaw
    June 2013
  • MEMS Analyst Panel: Sensor Fusion Growth and Trends
    Author: Yole Developpment
    June 2013
  • Sensor Fusion: The Market Potential
    Author: Marwan Boustany
    June 2013
  • Sensor Fusion Trends for Sensor Hub
    Author: Tony Massimini
    June 2013
  • Pre-Con Introduction
    Author: Karen Lightman
Sensors Expo 2013 - Conference Track 
  • From Sensor Fusion to Data Fusion: Enabling the Dream of Context Aware Mobile Devices
    Author: Tim Kelliher
    June 2013
  • Smart Integrated Sensors and Electronics for High Precision Applications
    Author: Baum, Billep, Wiemer, Gessner, Dittrich
    June 2013
  • Industrial Motion Sensors
    Author: Robert Badalian
    June 2013
  • Smart Sensor Systems Made Easy!
    Author: Pieter Struik, Ad Vaassen
    June 2013
  • Motion-based Power Control
    Author: Nitzan Gadish
    June 2013
  • The Critical Role of Packaging for MEMS Products
    Author: Matt Apanius
    June 2013
  • MEMS Applications in Medicine and Healthcare
    Author: Jay Esfandyari
    June 2013
  • Motion Control Technologies: Interface of the Future
    Author: Charles Gritton
    June 2013
  • Trends in the MEMS Marketplace and Trends in Wafer Bonding
    Author: Eric Pabo
    June 2013
MIG Presentations 
BSAC/MIG Fall Workshop 2013 
  • Cloud Computing, Fog Computing, and Other Enabling Technologies for the Internet of Things
    Author: Flavio Bonomi, Cisco Fellow, VP Advanced Architecture and Research, Cisco Systems
    September 2013
  • Sensor Fusion of the Future
    Author: Al Heshmati, InvenSense, Inc.
    September 2013
  • Illuminating the Fog: MEMS and Sensors Enablers for the Internet of Things
    Author: Karen Lightman, Executive Director, MEMS Industry Group
    September 2013
  • Power Impacts on Sensor and Sensor Fusion Design
    Author: Michael Stanley, Freescale Semiconductor
    September 2013
  • Indoor Navigation, Context Awareness & Data Fusion: A Marketer's Perspective on Designing for Always-on Services
    Author: Dave Rothenberg, Director of Marketing and Partner Alliances, Movea
    September 2013
MEMS Executive Congress US 2013 
  • MEMS Technology Showcase - Voting Keywords
  • Welcome to MEMS Executive Congress US 2013
    Author: Karen Lightman, MEMS Industry Group
    November 2013
  • MEMS Market Session Intro
    Author: Kevin Crofton, SPTS
    November 2013
  • MEMS Goes Mainstream: The Emerging Role of CMOS Foundries in MEMS Manufacturing
    Author: Gregg Bartlett, GLOBALFOUNDRIES
    November 2013
  • BlueChiip - Your Reliable Chain of Custody Partner
    Author: Jason Chaffey, Bluechiip, Ltd
    November 2013
  • Wireless Health: MEMS Killer App
    Author: Mehran Mehregany, Case School of Engineering
    November 2013
  • IoT: Creating Magical User Experiences
    Author: Luc Julia, Samsung Electronics
    November 2013
  • A Look Ahead: the Future of Connected Health
    Author: Donald Jones, Qualcomm Life
    November 2013
  • MEMS 2.0 (M2): The Next Generation
    Author: Maurice Thomas, US Volumetrics, Inc
    November 2013
  • Gas Sensing in an Elevator Pitch
    Author: Gino Putrino, Panorama Synergy
    November 2013
  • The Evolution of Mobile Input
    Author: Julia Schwartz, Qeexo
    November 2013
  • State of the MEMS Industry (Group)
    Author: Karen Lightman, MEMS Industry Group
    November 2013
  • Closing Thoughts
    Author: Karen Lightman, MEMS Industry Group
    November 2013
  • MEMS|cam
    Author: Eric Sigler, Digital Optics Corporation
    November 2013
  • MEMS is on the Move; EV Group is Moving MEMS
    Author: EV Group
    November 2013
  • The MEMS and Sensors Crystal Ball
    Author: Jérémie Bouchaud, IHS
    November 2013
  • iSketchnote
    Author: Steven Walsh, ISKN
    November 2013
  • UP by JAWBONE
    Author: Ivo Stivoric, JAWBONE
    November 2013
  • Kionix Intro to MEMS Technology Showcase
    Author: Kionix
    November 2013
  • MEMS Executive Congress US 2013 - Program
    Author: MEMS Industry Group
    November 2013
  • Status of the MEMS Industry: How Consumer Applications are Transforming the MEMS Industry
    November 2013
  • MEMS Executive Congress US 2013 - Attendee List
    Author: MEMS Industry Group
2014 International CES 
MEMS Education Series - Live in Scottsdale 
  • Dave Kirsch EV Group Intro
    Author: Dave Kirsch, Vice President and General Manager of EV Group North America
    February 2014
  • Helping You Navigate A Complex Sensor World
    Author: Ed Brachocki, Senior Director Product Marketing, Kionix, Inc.
    February 2014
  • MEMS Engineering Requirements and Issues
    Author: Eric F. Pabo, Business Development Manager MEMS, EV Group
    February 2014
  • Tronics … much more than a MEMS foundry
    Author: Hervé Borrel, President, Tronics North America
    February 2014
  • Jeannette Wilson Presentation
    Author: Jeannette Wilson, Product Marketing Manager, Computing Products Group
    February 2014
  • Applications and Commercial Issues
    Author: Matt Muddiman, Freescale Semiconductor
    February 2014
  • Intel & MEMS/Sensors
    Author: Steve Whalley, Director, Sensor Strategy & Technology Planning, Intel Platform Engineering Group
    February 2014
  • Overview of the MEMS Industry
    Author: Tony Massimini, Chief of Technology, Semico Research Corp.
    February 2014