The goal of the Best Known Practices (BKP) white paper series is to provide varied perspectives on the successful practices of fellow MIG members. These BKP documents are not intended to be a set of standards; but rather a resource guide to help your company learn from the experiences of others, in the search to overcome technical challenges to MEMS commercialization.
If you are interested in writing a document as part of the BKP series (as either a response to an existing document or on a new topic), please contact Monica Takacs at 412-390-1644. A list of suggested topics is located here. Check back often, we will be adding additional documents to this BKP site regularly.
Best Known Practices White paperS
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Metal Based Wafer Bonding Techniques for Wafer Level Packaging
Author: Shari Farrens, SUSS MicroTec
Published: December 1, 2009
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Mistakes People Make Developing MEMS Products - And What You Can Do To Avoid Them
Authors: Chris Lumb, Micralyne
Published: October 6, 2009 |
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MEMS Assembly Process Flow Scenarios
Authors: Michael A. Mignardi, DLP® Products, Texas Instruments & Kevin Chau, MEMStaff Inc.
Published: July 6, 2009
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Wafer Bonding Process Selection
Authors: Eric F. Pabo, PE; EV Group and Dr. Viorel Dragoi; EV Group
Published: May 14, 2009 |
