MEMS Education Series® Webinars
MIG members interested in submitting abstracts for potential MEMS Education Series webinars, please contact Chivonne at chyppolite@memsindustrygroup.org.

Upcoming Webinars


 

RF MEMS: A Solution for the LTE Advanced Standard and future 5G

April 17, 2014 | Hosted by Guillaume d'Eyssautier, DELFMEMS

Mobile handsets must operate over an increasing number of frequency bands. For LTE-Advanced, RF architecture becomes more complex, more expensive and consumes more power. MMMB (Multi Mode Multi Band) handset contains multiple RF Front End modules optimized for multiple frequency bands. This leads to component duplication and complex RF hardware. Until now, size reduction and increased functionality have been addressed by chip scaling. Now, passive RF components are the limiting factor for volumetric scaling and power consumption. New solutions for increased RF hardware integration and performances are needed. This discussion will be address how to overcome these challenges to make RF MEMS a success story.


 


 

M2M Preview

May 1, 2014 | 11:30 AM - 12:30 PM EDT

Join MEMS Industry Group as we delve into the exciting content at the 14th annual MIG Member-to-Member (M2M) conference, to be held in Berkeley, CA May 20-22. M2M is your focused opportunity to “lean in” and address the important, universal technical and business hurdles MIG members (and their customers) are challenged with at every step of the MEMS continuum, from the early concept and feasibility stage through to proof-of-concept, design win, successful commercialization, and volume MEMS production.

We’ll talk with the Working Group leaders, experts in their fields who are poised to share their knowledge and work with MIG members toward actionable items to benefit MEMS customers. To successfully commercialize a new product, business partnerships throughout the supply chain require well managed expectations, clear organizational alignment, consequent IP management and a well-structured, clearly defined collaborative engineering process based on the right IT infrastructure. This webinar will give a primer for the two workgroups at the upcoming M2M Forum focusing on the Innovation & Collaboration IP as well as on the Successful Tech Transfer matters.

View more information about M2M and each Working Group panel.


 

Past Webinars

Maximizing Public Relations Opportunities at MIG Japan, MIG Conference Shanghai and MEMS Executive Congress US 2014

April 2, 2014 | Hosted by Maria Vetrano, Vetrano Communications

This webinar will help you to take full advantage of MIG’s publicity program for some of our most popular events, MIG Conference Japan, MIG Conference Shanghai and MEMS Executive Congress US 2014. MIG’s PR consultant, Maria Vetrano, will both walk you through program highlights and field your questions.

Collaboration & Intellectual Property (IP) Management

February 5, 2014 | 11:30 AM - 12:30 PM ET

In most cases product development in the MEMS industry is a collaborative effort of several independent companies across the value chain.  Customer-tailored functions and specifications, customer in terms of OEM, etc., require a deep involvement of the customer throughout the complete value chain.  New and emerging application areas, short development cycles, and tight competition are challenges for collaborative product engineering in this field. Typically a product is brought to life by contracting different companies for the development of a specific product or part of a product (then using several partners to collaboratively develop the product).  Often the varying stages of the product engineering flow are carried out by diverse companies (or at least different departments) in different locations.  This collaboration is accompanied by pitfalls arising from the distribution of tasks and knowledge as well as the interdependencies between the different product parts.  In such a development setting the communication, holistic technology information management and IP management become key success factors.  To successfully commercialize a new product, business partnerships throughout the supply chain require well managed expectations, clear organizational alignment and a well-structured, clearly defined collaborative engineering process.
 
This webinar introduces a comprehensive methodology blueprint for customer-oriented product engineering that takes into account the challenges of concurrent device and process development as well as the challenges of distributed, networked operations between customers, designers, foundries, OSATS, etc. Topics like handling of data from different sources and data silos, exchange of research and development data and IP Protection will be covered.

  • Presented by: Dirk Ortloff, Founding CEO & CTO, Process Relations; Valerie Marty, MEMS Integration Engineer, HP
     
  • Hosted by: Karen Lightman, Executive Director, MEMS Industry Group

 

Integrating Information Security in your Development Lifecycle for Medical Devices

January 16, 2014 | 11:30 AM - 12:30 PM ET

This session will discuss why integrating information security in your development lifecycle for medical devices, from the outset, is a best practice.  Using secure coding practices as well as doing security testing and validation on the code must be performed from the outset in order to reduce risk.  In addition, connected medical devices (part of the Internet of Things ecosystem) could be targets of cyber-attacks, which may result in disruption of normal operation of the device, exfiltration of information, and other unwanted consequences (e.g., targeted, intentional attacks, not just “hacktivism”).  This is all the more reason why security must not be an afterthought that is retrofitted to already existing infrastructure.  Indeed, risks must be managed throughout the entire lifecycle of the product itself as new threats and vulnerabilities may be discovered or otherwise uncovered, especially given the sophistication and, at times, stealth associated with cyber-attacks. 

Suggested Resources:
HIMSS Privacy and Security Toolkit
FDA Safety Communications
FDA Guidance
ICS-CERT Alerts
CERT Secure Coding Initiative
 

  • Presented by: Lee Kim, BS, JD, HIMSS Director, Privacy & Security
     
  • Hosted by: Chivonne Hyppolite, Program and Event Manager, MEMS Industry Group

 


 

Manufacturing Trends for Consumer Inertial MEMS

November 13, 2013 | 11:30 AM - 12:30 PM ET

"Introducing the MEMS Industry Group", Karen Lightman, Executive Director, MEMS Industry Group.

MicroElectroMechanical Systems (MEMS) has been on a double-digit growth ride for the past five years and is expected to more than double again from $11B in 2012 to $23.5B by 2018 (source:  Yole Développement). As executive director of MEMS Industry Group—a global industry organization representing the MEMS supply chain—Karen Lightman has her finger on the pulse of the most exciting technology trends in MEMS and Sensors, including integration, sensor fusion, Wireless Sensor Networks (WSN) and energy harvesting. While MEMS and Sensors may be new to some, the technology is reaching market maturity to claim a spot in the mainstream. But challenges remain. The main challenges include standardization and fabrication. Ms. Lightman will highlight the latest progress made in MEMS standardization. She will also present a more robust manufacturing ecosystem in which specialized MEMS foundries and traditional CMOS foundries compete for customers, ultimately benefitting OEMs who get more for their money.

Understanding trends in MEMS and Sensors can and will enable users to successfully leverage the mobile ecosystem in the realization of the next generation of products and applications.

"New Technologies for the Next-Generation Inertial MEMS", Laurent Robin, Activity Leader Inertial MEMS Devices & Technologies, Yole Développement.

MEMS inertial sensors will achieve 11% growth in 2013, becoming a $4.0B market. This industry will enjoy continuous expansion in the future, as motion sensor shipments are currently booming. Although we see ongoing adoption in Automotive and an increasing interest in high-performance applications, the strongest wafer shipments’ driver is consumer applications.

To match these market drivers, component and die size are still being optimized, while combo approaches such as 6 and 9-axis sensors are becoming mainstream. Diverse technical solutions are being developed to optimize the front-end processing steps and the packaging of consumer inertial sensors. We also observe that disruptive approaches are being considered for the next generation of sensors, with new detection principles and new designs such as piezo detection, MEMS-compatible magnetometers, integration of nano structures, and more. 

This webcast will provide a market situation update and identify the major market drivers. Front-end and packaging evolutions will be discussed and a specific focus will be applied to the most promising new approaches. Lastly, we’ll discuss the details of sensors recently released on the market and which are already implementing new technologies.

"Advanced Packaging and Integration Techniques for Inertial MEMS", Robert Hergert, PhD, Senior Process Development Engineer, SUSS MicroTec Inc.

As MEMS inertial sensors become more prevalent in consumer applications there is a growing need to reduce package size and increase performance, while reducing overall production costs. In the back-end this can be achieved through innovative wafer level packaging and integration techniques. The key technologies to achieve these goals are found in wafer bonding  and  2.5D/3D integration.

Inertial sensors perform better when encapsulated in a controlled environment. This environment can be achieved through wafer level packaging. Several wafer bonding technologies can be used to achieve the hermitic environment required for high-performance inertial sensors. We will explore the design constrains, advantages and disadvantages of several of these wafer bonding techniques.

2.5D and 3D integration can further reduce the size and improve performance by allowing the stacking of sensors and CMOS circuitry. TSVs and interposers allow for a higher level of integration while reducing the overall size of the package. We will explain the advantages and challenges of implementing these techniques.

We provide an update on the state of the art wafer level packaging and integration techniques. As these methods gain broader application in the market inertial MEMS sensors will see a marked decrease in size and cost with an increase in performance.


Powered by: Yole Développement

Hosted by: i-Micronews.com

Sponsored by: SUSS MicroTec

Supported by: MIG


Moderator & Speakers:

  • Karen Lightman, Executive Director, MEMS Industry Group
     
  • Laurent Robin, Activity Leader Inertial MEMS Devices & Technologies, Yole Développement
     
  • Michael McLaughlin, Business Development - Yole Inc.
     
  • Robert Hergert, PhD, Senior Process Development Engineer, SUSS MicroTec Inc.

 


 

Leading Techniques for the Nano-scale Etching and Deep Etching of Silicon

October 31, 2013 | 11:30 AM - 12:30 PM ET


Michelle Bourke, Business Group Director at Oxford Instruments Plasma Technology has many years experience working in MEMS equipment and process development, and as such has a great understanding of the market.

As Micro Electro Mechanical Structures (MEMS) are adopted in more and more commercial and industrial applications some areas look to the nano world for developing technologies.  In this paper the two leading techniques for deep etching of silicon, namely the “Bosch” process and a cryogenically cooled process, will be discussed.  We will update the latest results for these techniques and also look at the growing importance of nano-scale etching of silicon, which can be achieved consistently using the cryogenically cooled process.  The paper will also briefly discuss atomic layer deposition (ALD) and demonstrate the role it can play in advanced micro and nano devices.

  • Presented by: 
    Michelle Bourke, Business Group Director, Oxford Instruments Plasma Technology; 

     
  • Hosted by: 
    Karen Lightman, Executive Director, MEMS Industry Group

 


 

Innovative Manufacturing Solutions for MEMS and Magnetic Sensors

August 7, 2013 | 11:30 AM-12:30 PM ET

We will discuss manufacturing solutions for next generation MEMS and Magnetic Sensors, such as patterning of advanced piezoelectric devices and high rate deposition of magnetic materials. 

The surging demand for low cost sensors requires fabrication methods that are proven high volume manufacturing techniques.  In this webinar, we will focus on manufacturing innovations required for unique materials:

  • New deposition techniques that enable the deposition of soft magnetic materials such as Permalloy, for a variety of magnetoresistive MEMS applications
     
  • The ability to sputter at high rates while maintaining magnetic alignment
     
  • Ion beam etch for patterning of advanced piezoelectric devices while maintaining critical dimensions
This webinar will discuss these and other inflections in the market and the prospects for automotive sensors in future.
  • Presented by: 
    Jeremie Bouchaud, Senior Principal Analyst, MEMS & Sensors and Industrial Electronics at IHS; 


    Katrina Rook, Ph.D., Process Engineering Manager at Veeco; 

    Frank Cerio, Director, PVD Technology at Veeco 

     
  • Hosted by: 
    Karen Lightman, Executive Director, MEMS Industry Group

 


 

Prospects for MEMS and sensors in the Automotive sector

July 16, 2013 | 11:30 AM-12:30 PM ET


The MEMS and automotive sensor market is expected to grow from $2.9 billion in 2012 to over $4 billion in 2017, a CAGR of around 7%. In the near-term, IHS iSuppli anticipates sales rates well above this figure, ultimately driven by mandates and emissions regulations relating to safety applications and powertrain in mature markets on the one hand, and emerging economies requiring initially basic sensor enabled functionalities on the other.

In the powertrain domain, emission regulations also keep manufacturers on their toes. In Europe, the advent of Euro VI standard in 2015 will impact both gasoline engines and the popular diesel market. Meanwhile, the electric vehicle poses the biggest threat to powertrain sensors—it will eliminate some but add new devices that manage the electric motors. Hybrid variants with combinations of combustion engine and electric powertrain will exist requiring more or less sensors in the internal combustion engine, underlying the fact that sensors will remain a key electronic component of today’s and tomorrow’s vehicles.

This webinar will discuss these and other inflections in the market and the prospects for automotive sensors in future.
  • Presented by: Richard Dixon, Principal Analyst MEMS & Sensors, IHS iSuppli
     
  • Hosted by: Karen Lightman, Executive Director, MEMS Industry Group

 

Micro- and nano-electromechanical switches: A detailed look into these promising technologies

June 18, 2013 | 11:30 AM-12:30 PM ET

The silicon solid state metal oxide semiconductor field effect transistor (MOSFET) has fueled a global technology revolution, but is reaching its performance limits.  A critical issue is device leakage.  A number of electromechanical relay architectures have been proposed to replace or complement MOSFETs.  These switches have low on resistance, near zero subthreshold leakage and can be made by self-assembly (bottom-up) or MEMS/NEMS (top down) fabrication methods.  Various switch designs and logic implementations will be described.  Scaling relations with respect to voltage, speed and contact resistance versus length scale will be considered.  We will then consider contact reliability and focus our attention on the importance of materials, surface preparation and gaseous environment. 

 
While work needs to be done to further improve their reliability, electromechanical switches are nearing widespread commercial use and represent a promising route towards further enhancing transistor technology. Attend this technical webinar to see the exciting promise these switches offer.
  • Presented by: Maarten De Boer, Mechanical Engineering Professor, Carnegie Mellon University
     
  • Hosted by: Karen Lightman, Managing Director, MEMS Industry Group

Slides are available to MIG members in the resource library. (login required.)


 

Standardizing the Internet of (Important) Things

June 10, 2013 | 11:30 AM-12:30 PM ET

The University of California- Berkeley, BSAC (Berkeley Sensor and Actuator Center) brings two renowned experts in the field of wireless sensor networks to discuss the latest developments in the standardization efforts of this burgeoning field.

“OpenWSN: Standards based enabler for the Industrial Internet”

The OpenWSN project is an open-source implementation of a fully standards-based protocol stack for capillary networks, rooted in the new IEEE802.15.4e Time Synchronized Channel Hopping standard. The tools developed around the low-power mesh networks include visualization and debugging software, a simulator to mimic OpenWSN networks on a PC, and the environment needed to connect those networks to the Internet. The OpenWSN project leads standardization efforts for ultra-low power M2M networks while contributing with innovative protocols for scalable, distributed and energy efficient communications.

“IETF 6TSCH: a New Standardization Effort to Combine IPv6 Connectivity with Industrial Performance”

6TSCH is a new group being created at the IETF, which focuses on combining IPv6 connectivity with industrial performance. Two major standardization bodies have been looking at low-power mesh networking: the IETF ("upper stack") and the IEEE ("lower stack").  6TSCH is working on combining the two. In this presentation, we will highlight the challenges the 6TSCH group needs to address, and discuss the first solutions which are being explored.
  • Presented by:
    Xavier Vilajosana
    Visiting Professor, UC Berkeley, BSAC

    Thomas Watteyne
    Sr Networking Design Engineer, Linear Technology, Dust Networks Product Group

     
  • Hosted by:
    Karen Lightman,
    Managing Director, MEMS Industry Group

Slides are available to MIG members in the resource library. (login required.)


 

Consumer & Mobile: MEMS El Dorado?

May 15, 2013 | 11:30 AM-12:30 PM ET

The expansion of MEMS sensors in consumer markets continues unchecked. The market for MEMS sensors in this sector grew 15% in revenue last year to reach $2.9 billion, and in 2013, should grow by another 18%. By 2016, the market will have almost doubled to $5.6 billion, despite aggressive price erosion.


Sensors other than MEMS are also gaining traction in mobile applications. Light sensors are already standard issue in smartphones in the form of ambient light and proximity sensors, RGB color sensors recently joined the fray. Humidity sensors had a breakthrough when this type of sensor was adopted by the Samsung Galaxy S4 mobile phone. UV, gas and other environmental/health sensors will also be coming to a cell phone near you soon.

In this webinar, IHS will present its latest findings on the most exciting MEMS and sensors areas, the increasing focus on combo sensors, regional trends, emerging and new applications and opportunities for newcomers.

  • Presented by: Jérémie Bouchaud , Director & Senior Principal Analyst, MEMS & Sensors - IHS iSuppli
     
  • Hosted by: Karen Lightman, Managing Director, MEMS Industry Group

Slides are available to MIG members in the resource library. (login required.)


 

MEMS Enabling Mobile Healthcare Innovation

April 17, 2013 | 11:30 AM-12:30 PM ET

The healthcare market is slow to adopt new technologies due to strict regulations they must follow for patient safety and privacy. This is why, while most other markets have embraced new technology, the healthcare market is still relying on fax machines and handwritten notes.  But we are reaching the point where the current health system is unsustainable because there are too many people who are elderly or ill, combined with astronomical healthcare costs, and rapidly improving technological capabilities that are driving consumers to demand better care.  

The future of healthcare is being manufactured by the consumer’s demand for big data.  And big data is made possible in part by MEMS.  This webinar will address how MEMS and the changing healthcare culture have come together to create a perfect environment for innovation within the consumer segment.

  • Presented by: Michell Prunty, Senior Consumer Analyst for Semico Corporation
  • Hosted by: Karen Lightman, Managing Director, MEMS Industry Group

Slides are available to MIG members in the resource library. (login required.)

Critical Success Factors for the Commercialization of MEMS: The 2012 MEMS Industry Report Card

April 2, 2013 | 11:30 AM-12:30 PM ET

Barriers to the commercialization of every industry and technology exist, and MEMS is no exception. This presentation presents a "MEMS Industry Report Card for 2012", which addresses 14 critical success factors/barriers for the commercialization of MEMS and the progress made to date to overcome these barriers.  Some of the topics addressed are: R&D, Marketing, Infrastructure Development, Management Expertise, Creation of Wealth and Profitability.

This report card has been updated and presented annually since 1998 and continues to be presented yearly to enthusiastic audiences worldwide. Come join the latest of these critical discussions.

  • Presented by: Roger Grace, President of Roger Grace Associates
  • Hosted by: Karen Lightman, Managing Director, MEMS Industry Group

Slides are available to MIG members in the resource library. (login required.)


 

Inertial Micropump Technology for Microfluidic Applications

Original Webinar Date: March 27, 2013

  • Presented by: Alexander Govyadinov, Lead Technologist, Hewlett Packard - Printing and Technology Development Organization 
  • Moderated by: Mike Pinelis, CEO, MEMS Journal, Inc.

Slides are available to MIG members in the resource library. (login required.)


 

Replay Webinar

 

How the International Trade Administration Can Help MEMS Industry Group Members Increase Exports

Original Webinar Date: January 30, 2013

Presented by:

MIG members, download the slides in the MIG resource library. (login required)


 

Replay Webinar

Innovations in RF MEMS: from the University to Industry

Original Webinar Date: January 25, 2013

MIG members, download the slides in the MIG resource library. (login required)


 

Replay Webinar

Where is the love for MEMS?

Original Webinar Date: November 29, 2012

Speakers:

  • Peter Himes, Vice President, Marketing and Strategic Alliances, Silex Microsystems
  • Bryon Moyer, Writer/Editor, Tech Focus Media/Electronic Engineering Journal
  • Mike Rosa, MEMS Senior Global Marketing/Product Manager, Applied Materials

MIG members, download the slides in the MIG resource library. (login required)


 

Replay Webinar

2012 Status of the MEMS Industry

Original Webinar Date: October 3, 2012


 

Replay Webinar

Health Care is Brimming with Opportunities for MEMS

September 11, 2012 | 11:30 AM ET, 8:30 AM PT

  • Presented by: Mehran Mehregany, Ph.D., Director, Wireless Health Program & Goodrich Professor of Engineering Innovation at Case Western Reserve University

MIG members, download the slides in the MIG resource library. (login required)


 

Replay Webinar

MEMS Packaging – Transforming the Challenges into Solutions

August 21, 2012 | 11:30 AM ET, 8:30 AM PT

  • Presented by: Charles Richardson, Director of Roadmapping, iNEMI and Bill Bottoms, 3MTS and iNEMI/ITRS (International Electronics Manufacturing Initiative/International Technology Roadmap for Semiconductors) & Packaging TWG Chair

MIG members, download the slides in the MIG resource library. (login required)


 

Replay Webinar

MEMS: Looking for the Next Killer App

Original Webinar Date: July 25, 2012 

  • Presented by: Jérémie Bouchaud, Director & Senior Principal Analyst, MEMS & Sensors, IHS iSuppli

MIG members, download the slides in the MIG resource library.


 

Replay Webinar
Innovative MEMS Packaging for Future Technologies
  • Presented by  Andrew “Andy” Oliver Ph.D., Industrial Liaison and Principal Staff Scientist, Wireless Integrated MicroSensing and Systems Research Center (WIMS2), University of Michigan

Original Webinar Date June 13, 2012. MIG members, download the slides in the MIG resource library.

Replay Webinar


M2M Forum Recap 

  • Presented by  Eric Levy-Myers, Consultant, MEMS Industry Group and Karen Lightman, Managing Director, MEMS Industry Group

Original Webinar Date Thursday, May 31, 2012. MIG members, download the slides in the MIG resource library.

 
Replay Webinar

M2M Forum Webinar: Market Pull vs. Technology Push

Original Webinar Date Tuesday, April 27, 2012. MIG members, download the slides in the MIG resource library.

 
Replay Webinar

Presented by Jim Knutti, Ph.D., President / CEO, Acuity IncorporatedMike Mignardi, Ph.D., Manager, Energy Harvesting, Texas Instruments, Eric Levy-Myers, Consultant, MEMS Industry Group, and Karen Lightman, Managing Director, MEMS Industry Group


MEMS and Nano in Diagnostics: Clinical and Investment Perspectives

Original Webinar Date Tuesday, April 10, 2012. MIG members, download the slides in the MIG resource library.

 
Replay Webinar

Presented by Mostafa Analoui, Ph.D., Head of Healthcare and Life Sciences at Livingston Securities.


MEMS Reliability: A Case Study

Original webinar date: Tuesday, March 27, 2012.
MIG m
embers, download the slides in the MIG resource library.

 
Replay Webinar

Presented by Hari Rajgopal on behalf of Mehran Mehregany, Ph.D., Case Western Reserve University


M2M Forum Webinar

Technology Development Process and Product Life Cycle: A MEMS View

This webinar is a sneak peak of the MEMS Product Life Cycle Template and a case study on automotive MEMS pressure sensors we've been working on as part of the research for our annual members meeting, M2M Forum: Focus on MEMS New Product Development.

Original webinar date: February 23, 2012 
Members, please visit the MIG resource library to view the slides.

Replay Webinar

Presented by

Hosted by

  • Karen Lightman, MEMS Industry Group


MEMS Executive Congress Europe Preview

Original Date Thursday, February 16, 2012
View Slides.

Replay Webinar

Presented by Karen Lightman, MEMS Industry Group


Improving Performance of New MEMS Designs: An Insider’s Look at imec’s SiGe above-IC MEMS Technology Platform 

Original webinar date: January 17, 2012 
Please visit the MIG resource library to view the slides.

Replay Webinar

Presented by Simone Severi, Team Leader, MEMS Integration Group, imec

Moderated by Eric Pabo, Business Development Manager - MEMS, EV Group
Hosted by Karen Lightman, MEMS Industry Group

 


Concurrent Design to Achieve High Performance and Low Cost: Case Study of a MEMS Automotive Pressure Sensor Design

Original Webinar Date: Tuesday, December 13
Members, click here for the slides.

Replay Webinar

Presented by David DiPaola, Managing Director, DiPaola Consulting
Moderated by Rob O'Reilly, Senior Member Technical Staff, Analog Devices and Karen Lightman, Managing Director, MEMS Industry Group


MEMS Devices Driving Healthcare Applications

Original Webinar Date: November 9, 2011
Members, click here for the slides.  

Replay Webinar

Presented by Frédéric Breussin, Project Manager at Yole Développement.

The webinar provides an overview of the MEMS sensors market for medical applications, trends and emerging technologies.


A Technology Platform for MEMS Scanner Products - An Approach to Overcoming MEMS Law

Original Webinar Date: October 20, 2011
Members, click here for the slides.

Replay Webinar

Presented by: Michael Müller, Deputy Head of Department Engineering, Fraunhofer Institute for Photonic Microsystems (IPMS)
Co-hosted  and Moderated by: Steve Breit, Vice President, Engineering, Coventor

Coventor and Fraunhofer IPMS discuss "MEMS Law" and ways that MEMS foundries and MEMS device manufacturers are overcoming the described lack of standardization.


Overview of Current State of MEMS Reliability and Test

Original Webinar Date: September 26, 2011
Members, click here for the slides.

Replay Webinar

Presented by Mehran Mehregany, Director, Case School of Engineering - San Diego


Improving Performance of MEMS Designs Using Optical Characterization

Original Webinar Date: September 14, 2011

Replay Webinar

Polytec presents several characterization studies that have successfully applied Micro System Analyzer (MSA) technology using optical characterization of MEMS. 


New Prototyping Technologies Reduce Time to Market

Original Webinar Date: August 25, 2011

Replay Webinar

Sarah Boisvert, Co-Founder of Potomac Photonics, will share her knowledge through case studies and personal experiences about helping your company reduce the time to market of your MEMS products.


Additional archived webinars slides can be found in the Document Library.