MEMS Industry Group Create An Account  |   Become A Member  |   Login
MEMS Industry Group Home

METRIC

 

Download presentations and materials from the METRIC 2010: Focus Optimizing MEMS Fabrication Portal (member login required)

 

Thank you to all who attended the annual members-only meeting of MEMS Industry Group at

 

METRIC 2010

Focus on Optimizing MEMS Fabrication

MEMS Manufacturing and Managing the Cost of Having a Fab/Fabrication

May 18 - 19, 2010 | Wyndham San Jose | www.memsmetric.com

Quick Links

The goal of METRIC 2010 was to identify and overcome technical and business challenges in regards to MEMS fabrication.

METRIC 2010 working groups focused on the technical challenges in optimizing MEMS fabrication, new opportunities for MEMS, advances in packaging technologies and alternatives to silicon,  benefits and pitfalls the captive fab versus the fabless business models, and partnering and working with a foundry.

METRIC is the annual meeting for MIG members only. MIG encourages member companies to send two individuals to METRIC who are able to contribute technical experience to the discussions. If you would like more information about joining MIG so that you may attend METRIC, please contact Monica Takacs (412-390-1644, email mtak...@memsindustrygroup.org). View the many membership benefits in addition to METRIC.

Download the slides from MIG's METRIC 2010 preview webinar, for an introduction to METRIC and this year's topic.

 

Working Groups

Track 1

Morning Group - Technical Challenges in Optimizing MEMS Fabrication
Moderators:
Dr. Eric Lautenschlager, MEMS Engineering Manager, Knowles Electronics
Chris Milne, Manager – MEMS Process and Support Engineering, Honeywell

The Technical Challenges in Optimizing MEMS Fabrication working group will focus on issues including design evolution and the general characteristics of multi-generational designs; cost considerations of wafer size, testing, materials; hunting “yield killers;” and the tradeoffs between using silicon vs. other substrates.
 

Afternoon Group – New Opportunities for MEMS Fabrication
Moderators: David Buckley, VP Sales and Marketing, Micralyne
Eric Pabo, Global Business Development Manager for MEMS, EV Group

The New Opportunities for MEMS Fabrication working group will focus on new and innovative improvements in MEMS fabrication. Topics include CMOS/MEMS integration; Wafer-level vs. unit-level packaging; 6” vs. 8” wafers; alternatives to silicon (including glass and plastics), using existing semiconductor equipment for fabricating MEMS; and designing for manufacturability, test, and cost.
 

Track 2

Morning Group – Captive Fab, Fab-lite vs. Fabless Models
Moderators: Tom Chang, North American Marketing Consultant, Asia Pacific Microsystems
Dr. John McKillop, Managing Director, Tekton Consulting

The Captive Fab, Fab-lite vs. Fabless workinggroup will explore the benefits, pitfalls, and tradeoffs of each model. The group will discuss the cost of ownership of a fab versus fabless options with respect to the issues of low volume/concept development , process and volume.
 

 

Afternoon Group – Working with a Foundry

Moderators: Harry Engwer, Semiconductor Support Services
Magnus Rimskog, Sales Director, North America, Silex Microsystems

The Working with a Foundry working group will discuss typical foundry business models and the associated volume and cost considerations. The group will also delve into the elements to a successful partnership, processes (standard vs. non-standard, design rules), and improving transparency in foundry specifications in regards to surface and bulk micromachining, integration, packaging, and testing.

 

 Panel Discussions

Evening Panel, May 18 - MEMS Integration – Harnessing the “MEMS Inside” Potential?
Panelists:
Prakash Krishnan, Director of Marketing, SVTC
Roger Grace, President, Roger Grace Associates
John Heck, Research Scientist, Intel
Eric Levy-Myers, Adjunct Consultant, Science Technology Policy Institute

Moderator: Asif Chowdhury, Director, World Wide Manufacturing, Analog Devices

This panel will discuss the increasing number of MEMS devices being integrated and the driving forces for integration. Panelists will share their success stories and lessons learned about MEMS integration in regards to monolithic integration vs. multi-chip packaging, pre-or post-CMOS integration, wafer-level packaging, and integrating processes. As the MEMS industry looks to expand into new markets and increase market-share, this panel is not to be missed.

Morning Panel, May 19 - The Many Faces of MEMS Fabrication – In-house, Fab-lite, and Fab-less
Panelists: Salah Uddin, Partner, Co-Founder, Nanoshift LLC
Claude Jean, Executive VP & General Manager Foundry Operation, DALSA Semiconductor
Scott Naugle, VP, Manufacturing, Akustica
Ruta Venclovas, Consultant
Dr. Carolyn White, Associate, AM Fitzgerald & Associates

Moderator: Dr. Uwe Kleinkes, CEO, IVAM

On this panel, MEMS companies will discuss the technical challenges and different experiences of the fab vs. fabless vs. fab-lite models. Panelists will delve into the benefits and pitfalls of each model, and weigh the significant tradeoffs that come when choosing a model.

 

Schedule of Events

Tuesday, May 18, 2010
6:30 - 9:00 PM

 

Wednesday, May 19, 2010
Breakfast 7:00 - 8:00 AM
Welcome and MIG Activities Update 8:00 - 8:30 AM

Panel Discussion: The Many Faces of MEMS Fabrication – In-house, Fab-lite, and Fab-less
8:30 - 9:30 AM
Break 9:30 - 10:00 AM

Morning Working Groups
Technical Challenges in Optimizing MEMS Fabrication
-or-
Captive Fab vs. Fabless Models

10:00 AM - 12:00 PM
Lunch 12:00 - 1:30 PM

Afternoon Working Group Session
New Opportunities for MEMS Fabrication
-or-
Working with a Foundry

1:30 - 3:30 PM
Break 3:30 PM - 4:15 PM
MEPTEC Update 4:15 PM - 4:30 PM
METRIC Working Group Leader Presentation and Wrap-up 4:30 PM - 5:15 PM
Optional Networking Reception

6:00 PM - 8:00 PM

 

Registration Information

METRIC registration is limited to members of MEMS Industry Group only. 

Event Policies

  • Substitutions from the registrant’s organization are welcomed and allowed at any time, free of charge.
  • Cancellations made 30 or more days before the event will be refunded minus a 5% processing fee.
  • Cancellations made 5 to 29 days before the event will be refunded minus a 15% processing fee.
  • No refunds will be issued for cancellations made 0-4 days before the event.
  • No-shows to the event will not be refunded.
  • All requests for cancellations must be made in writing (email or fax) and received by the dates listed above for a refund to be issued.
  • MIG is not responsible for refunds for hotel accommodations or travel expenses.


 Hotel Venue Information

Wyndham San JoseMETRIC 2010 will be held at the Wyndham San Jose located in the heart of Silicon Valley. Rooms at the Wyndham are available for $129/night plus tax and reservations can be made by calling the hotel at 408-453-6200 (mention the MEMS Industry Group METRIC meeting). 

1350 North First St
San Jose, California 95112
408-453-6200

Rooms will be held at the group rate until April 26, 2010 or until the hotel is sold out so make sure to book your room early.

The Wyndham San Jose is located a mile and half from San Jose International Airport and adjacent to the city's light rail transit accessing the corporate district and downtown. Easy access to Highways 101, 880, 280, 85 and 87. Get directions to the hotel.

 Complimentary shuttle service to and from San Jose International Airport is available. 

 

MEPTEC MEMS Symposium

MEPTEC MEMS SymposiumCome for METRIC and stay for MEPTEC's MEMS Symposium. METRIC and MEPTEC's MEMS Symposium are co-located this year, with the MEMS Symposium taking place on May 20, 2010.

MIG members receive a discount to attend the MEMS Symposium.

Read more information.