X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing devices on silicon wafers for mixed-signal integrated circuits (ICs), CMOS sensors and MEMS. X-FAB Operates from five manufacturing locations in the USA, Germany and Malaysia offering wafer capacity of over 850,000 200mm-equivalent wafers per year. X-FAB maintains compliance to ISO standards for Automotive and Medical foundry manufacturing and all operations are ISO/TS 16949 certified.
The largest specialty fab group, X-FAB is unlike typical foundry services because of its expertise in combining advanced analog and mixed-signal CMOS process technologies with MEMS, specialised materials and wafer-level bonding and packaging. CMOS processes include options for non-volatile memory, high-voltage and high temperature. Along with customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP blocks for key sensor types including pressure sensors, inertial sensors, CMOS image sensors and ambient light sensors.