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X-FAB Semiconductor Foundries AG
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Last updated: 5/19/2016
X-FAB Semiconductor Foundries AG
MEMS/Sensors Foundry
Professional Information
X-FAB Semiconductor Foundries AG
99097  Germany
  Accelerometers, Energy, Flow Sensors, Gyroscopes, Microphones, Optical MEMS, Oscillator, Pressure Sensors, Relative Humidity Sensors, RF-MEMS, Temperature Sensors, Thermal Sensor, Tire Pressure Monitoring System (TPMS), Vibration Sensor
  Feasability, Low Volume Fabrication, Manufacturing Services, Metal Via, Modeling, Pilot Services, Process Development, Prototyping, Silicon Deep Reactive Ion Etch (RIE), Technology Transfer to Foundry, Through Silicon Via, Volume Production Ramp, Wafer Bonding
  X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing devices on silicon wafers for mixed-signal integrated circuits (ICs), CMOS sensors and MEMS. X-FAB Operates from five manufacturing locations in the USA, Germany and Malaysia offering wafer capacity of over 850,000 200mm-equivalent wafers per year. X-FAB maintains compliance to ISO standards for Automotive and Medical foundry manufacturing and all operations are ISO/TS 16949 certified.

The largest specialty fab group, X-FAB is unlike typical foundry services because of its expertise in combining advanced analog and mixed-signal CMOS process technologies with MEMS, specialised materials and wafer-level bonding and packaging. CMOS processes include options for non-volatile memory, high-voltage and high temperature. Along with customer specific process installation, X-FAB offers a range of qualified, in-production, open-platform processes and IP blocks for key sensor types including pressure sensors, inertial sensors, CMOS image sensors and ambient light sensors.
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