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Asia Pacific Microsystems (APM)
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Last updated: 12/29/2014
Asia Pacific Microsystems (APM)
MEMS/Sensors Foundry
Professional Information
Asia Pacific Microsystems (APM)
Project Manager
300, R.O.C  Taiwan
  Accelerometers, Functional Sensors, Gyroscopes, Microphones, Optical MEMS, Pressure Sensors, Temperature Sensors
  Inspection, Metrology, Process Design, Shortloop Experimentation
  Bonding Material, Glass Wafers, Quartz Wafers, Silicon Wafers, Structured Wafers and Substrates
  Chemical Vapour Etching (CVE), Coat Develop and Expose, Deep Reactive Ion Etching (DRIE) Systems, Inductively Coupled Plasma (ICP), Lithography, Mask Aligner, Mask and Bonder Aligners, Plasma Enhanced Chemical Vapour Deposition (PECVD), Wafer Bonding, Wet Etch Protection Systems, Wet Processing Systems
  Design for Manufacturability (DFM), Feasability, Low Volume Fabrication, Manufacturing Services, Pilot Services, Process Development, Prototyping, Research & Development, Silicon Deep Reactive Ion Etch (RIE), Technology Transfer to Foundry, Volume Production Ramp, Wafer Bonding
Hsin-Chu, Taiwan, Taiwan R.O.
300  Taiwan
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  •Established: August 2001

•Pure–play MEMS foundry with manufacturing experience on: Inkjet, pressure sensor, accelerometer, gyroscope, MOEMS, microbolometer, LED submount, and luminant sensor.

Advantage: Fast prototyping and high volume production capability with a competitive cost
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