Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world's most successful electronics companies.
We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF,analog, digital, and mixed signal test.
Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterisation and modelling.
Unisem is an established MEMS OSAT with several years experience of volume consumer and automotive production and a broad package portfolio covering multiple applications.
We have factory locations in Ipoh, Malaysia; Chengdu, People's Republic of China; Batam, Indonesia; and Sunnyvale, USA. Unisem is headquartered in Kuala Lumpur, Malaysia.
For complete information, please visit www.unisemgroup.com.