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SPTS Technologies: SPTS/XACTIX XeF2 etching
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SPTS/XACTIX XeF2 etching

Chemical Vapour Etching (CVE) of silicon

Salient features: Jointly developed by SPTS and XACTIX, Inc, the CVE system offers dry, plasma-less, isotropic etching of silicon, which uses XeF2 gas to remove sacrificial silicon layers and release MEMS devices without stiction, which can occur with wet etch solutions. XeF2 offers an extremely high selectivity to silicon over most other materials. Patented chamber design is optimized for gas phase etching with edge lift to protect delicate double sided wafers. Cooled chuck with optional backside helium for improved etch rates, uniformity and selectivity. Design offers easy conversion between 150 and 200mm wafers and the ability to clamp a wide variety of substrate thicknesses. The CVE is available on a wide range of wafer handling options, including cluster configurations to enable transfer under vacuum from a wide variety of SPTS' DRIE, plasma etch and deposition modules 

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