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SPTS DRIE systems
DRIE of silicon, for deep, dry, anisotropic silicon micromachining
Salient features: Compatible for silicon wafers up to 300mm, SPTS’ DRIE systems offer market-leading silicon etch rates, excellent cross-wafer uniformity and high silicon selectivity to mask materials and reduced tilting of features near the edges of large wafer sizes, important for maximizing device yield.
Available on a range of wafer handling platforms from single wafer loadlock for R&D to production-proven multi-chamber cluster tools with fully automated cassette-to-cassette loading for high volume manufacturing applications