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SPTS Technologies: SPTS PVD
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SPTS’ Sigma® fxP™ is a single wafer cluster tool designed for high-volume Physical Vapor Deposition (PVD) processing. The cluster architecture of the Sigma® fxP™ sputter deposition system offers excellent process control with high throughput. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversion. Process Modules •Heat – Lamp driven wafer degas module •Soft Etch – ICP sputter etch module for surface pre-treatment and via clean prior to metal deposition •Standard PVD – conventional DC and pulsed DC sputter module for deposition of a wide range of materials •Hi-Fill PVD – long throw deposition module with increased target to substrate spacing offering improved bottom coverage for high aspect ratio structures •Advanced Hi-Fill PVD – ionized variant of the Hi-Fill chamber delivering outstanding bottom and sidewall coverage for the most challenging high aspect ratio structures at the lowest Cost of Ownership (CoO) •C3M – MOCVD TiN based on TDEAT/NH3 chemistries to deliver virtually conformal liner coverage in deep structures at wafer temperatures ‹ 350°C

Applications include: •Back-end Silicon Interconnect •Thick frontside metals for power applications •Backside metals for power applications •Compound and Micro/Nanotech •Compound metal applications •Highly oriented Aluminum Nitride for BAW devices 

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