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SPTS Technologies: SPTS PECVD
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Plasma enhanced deposition of wide range of organic, inorganic, doped and undoped thin films

Salient features: PECVD allows film deposition at lower temperatures (<350°C) than conventional CVD. SPTS PECVD is available with an optional Liquid Delivery System which allows the use of low vapour pressure pre-cursors such as TEOS. SPTS PECVD offers independent adjustment of plasma chemistry, RF frequency, substrate bias, and wafer temperature to give accurate control of film properties such as RI, hardness and internal stress. Available on a range of wafer handling platforms from single wafer loadlock for R&D to production-proven 4-chamber cluster tools with fully automated cassette-to-cassette loading for high volume manufacturing applications 

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