Brewer Science Unveils Apogee™ Temporary Wafer Bonder at CS MANTECH
Monday, May 19, 2014
Brewer Science, Inc., a leading supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science® Apogee™ bonder for temporary wafer bonding applications. This marks an industry milestone in leveraging Brewer Science’s unique ability to combine processing equipment, high-temperature temporary adhesives, and process integration into a seamless thin-wafer handling solution.
The Apogee™ bonder supports multiple temporary bonding/debonding technologies including thermal slide, mechanical peel, and laser release debonding. The Apogee™ bonder completes the Brewer Science thin wafer handling tool suite for low-volume compound semiconductor production of RF filters, analog power devices, LEDs, and solar devices. This collection of tools provides reduced time to market for ultrathin wafer technologies using Brewer Science’s integrated material and process solutions.
The Brewer Science® Apogee™ bonder delivers exceptional accuracy, interface capabilities, and process flexibility. Industry-leading features include:
Substrate size range of 50-300 mm
Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
Ultraflat self-leveling platens minimize total thickness variation (TTV)
Evacuated bond chamber eliminates voids
Carrier and device are separated during pre-bond evacuation
Total thickness variation: <10%
Real-time access and control to process data and push notifications
Brewer Science processing equipment allows customers to cost-effectively enter new areas of product development and low-volume manufacturing. The equipment product suite can be used to develop process technologies for compound semiconductor, ultrathin CMOS, and MEMS manufacturing as well as thin films, sensors, and advanced packaging. The compact footprint, intuitive design, durability, and experience add up to years of high-performance processing that makes this tool suite perfect for low-volume production or R&D lab environments.
Visit Booth 33 at CS MANTECH, May 19-22, to learn about Brewer Science’s integrated materials, processes, and equipment platforms. Justin Furse, Technology Strategist, will present “Thin Wafer Bonding/Debonding in Low-Volume Compound Semiconductor Production" on Tuesday, May 20, at the Exhibitor Forum. Interested individuals unable to attend CS MANTECH may visit the Apogee™ temporary bonder web page or email email@example.com.
About Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the reliable fabrication of cutting-edge microdevices used in electronics such as tablet computers, smartphones, digital cameras, televisions, and LED lighting. Since 1981, when its ARC® materials revolutionized lithography processes, Brewer Science has expanded its technology to include products used in advanced lithography, thin wafer handling, 3-D integration, and chemical and mechanical device protection and products based on carbon nanotubes and nanotechnology. With its headquarters in Rolla, Missouri, Brewer Science supports its worldwide customers through a service and distribution network in North America, Europe, and Asia.
Learn more about Brewer Science at www.brewerscience.com; follow us on Twitter @BrewerScience, or like us on Facebook.
For more information about this topic, or to schedule an interview, contact: Patti Shaw, Brewer Science, Tel: (US) +1.573.364.0300, Ext: 1183, Email: firstname.lastname@example.org.