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News & Press: MEMS Executive Congress US 2014 News

MEMS Executive Congress Keynotes Explore Co-Creation on Many Levels

Monday, September 22, 2014   (0 Comments)
Posted by: MEMS Industry Group
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MEMS Executive Congress® US 2014

November 5-7, 2014

JW Marriott Scottsdale

Camelback Inn Resort &


An annual executive forum promoting the commercialization of MEMS and sensors




MEMS Executive Congress Keynotes Explore Co-Creation on Many Levels


Billions of MEMS devices and sensors bring intelligent sensing and actuation to nearly every electronic system imaginable. With high volumes, more sophisticated functionality and fast design-to-delivery times increasingly the norm, how will the MEMS/sensors supply chain continue to meet short- and long-term demand?

MEMS Industry Group (MIG)’s two keynote speakers at MEMS Executive Congress® US 2014 approach this challenge from their own definitions of ‘co-creation’ — one involving collaboration between product designer and foundry and the other involving a co-creation business process involving communities of developers and their end-user customers.

The Next Big Thing

George Liu, director of corporate development, Taiwan Semiconductor Manufacturing Company (TSMC)



What’s the next big thing in technology? Is it wearable, smart home, robotic, Internet of Things or is it the new “3C” (client, connectivity, cloud) rolled into one?


For IC and sensor makers like TSMC, the question is how to provide the most user-friendly building blocks to accelerate, improve and grow the “next big thing” (NBT) for the world – so that it will be smaller, lighter, faster, powered longer and cheaper.


Integration and collaboration are the best ways to achieve the NBT — integration by Moore’s Law (and even after Moore’s Law slows down), integration of specialty features, and integration at the package level. IC foundries expertly support the ever-increasing need for integration through a combination of scalability and flexibility.


Close collaboration between foundries and product designers is critical as well. Collaboration ultimately speeds time to market, produces optimized technology and maximizes capital return. Working as one family, IC foundries can build the best NBT for years to come.


Getting to a Trillion Sensors: Why MEMS Engineers Have to Become Ecosystem Co-creators


Francis Gouillart, CEO, Experience Co-Creation Partnership



Co-creation can be a powerful model in developing a MEMS-based ecosystem. Through this model, business ecosystems form and “lock-in” when a compelling platform starts crystallizing a community of players around the ability to create significant value together.

Drawing on his vast experience of working with many leading agricultural companies around the world, Francis Gouillart will explain how the co-creation model that he developed with colleagues at the University of Michigan can open the massive use of MEMS and sensors in precision agriculture.

Success will depend on the industry’s migration from a classic process- and product-driven development paradigm to the active engagement of communities of developers and users in a joint platform- and data-driven development effort.

MEMS/sensors companies must also work closely with technically savvy lead users — progressive farmers as well as agricultural equipment, seed and agricultural chemical companies — to build a common platform that will spawn a thriving MEMS-based agricultural ecosystem.


Please join us for our tenth annual MEMS Executive Congress keynotes:

George Liu, director, TSMC

The Next Big Thing

8:30-9:15 am Thursday, November 6


Francis Gouillart, CEO, Experience Co-Creation Partnership

Getting to a Trillion Sensors: Why MEMS Engineers Have to Become

Ecosystem Co-creators

10:30-11:45 a.m. Friday, November 7


Press Registration

Working journalists who are interested in attending MEMS Executive Congress US 2014 may be eligible to attend the event at no cost by sending a written request for press credentials to Maria Vetrano, public relations consultant, MEMS Industry Group, Tel: 617.876.2770, Email: maria[at]vetrano.com.

For the complete agenda, visit: http://us2014.memscongress.com/agenda/.


Host Organization





Premier sponsors of MEMS Executive Congress US 2014 include: Platinum Sponsor EV Group; Gold Sponsors Lam Research Corporation and SPTS Technologies; Silver Sponsors Analog Devices and Freescale Semiconductor; and Bronze Sponsors Applied Materials and X-FAB MEMS Foundry.

Event sponsors include: Acuity Incorporated, AEPI Grenoble-Isere France, Akustica, Bosch Automotive Electronics (AE), Bosch Sensortec GmbH, Coventor, Expertech, IHS Global, MEMS Journal, Micrel, MEMS & Nanotechnology Exchange, Okmetic, QuickLogic, Rogue Valley Microdevices, Semico Research, Solid State Technology, SunEdison Semiconductor, Sustainable Valley Technology Group, Tronics and Yole Développement.


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MEMS Industry Group  1620 Murray Ave  Pittsburgh, PA 15217 USA  info@memsindustrygroup.org


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